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Sintering method of piezoresistor ceramic chip
The invention discloses a sintering method of a piezoresistor ceramic chip. The sintering method comprises the steps of (1) preparing roasted particles; (2) preparing a piezoresistor green body; (3) preparing a roasting column; (4) preparing sagger matrix padding; (5) loading the sagger; and (6) sintering the piezoresistor. According to the invention, the roasting column with the same thermal expansion coefficient as the piezoresistor green body is used for supporting an anti-deformation parallel cover plate at high temperature, so that the lower surface of the parallel cover plate and the upper surface of the stacked piezoresistor green body form and always keep a tiny acting force in the sintering process under the condition of synchronous thermal shrinkage in the sintering process, andbending deformation of the surface of the piezoresistor is prevented. The prepared piezoresistor ceramic chip is smooth in surface and not prone to deformation, the yield reaches 99.9% or above, and the sintering method is simple in process, easy to operate and suitable for large-batch industrial production.
本发明公开了一种压敏电阻瓷片的烧结方法，包括以下步骤：（1）制备焙烧颗粒、（2）制备压敏电阻坯体、（3）制备焙烧柱、（4）制备匣钵基体垫料、（5）装载匣钵、（6）烧结压敏电阻。本发明利用与压敏电阻生坯体相同热膨胀系数的焙烧柱支撑高温下防变形的平行盖板，使得在烧结过程中，热收缩同步的情况下，平行盖板下表面与堆叠的压敏电阻生坯体上表面在烧结过程中形成并一直保持一个微小的作用力，阻止压敏电阻表面发生弯曲变形。所制备得的压敏电阻瓷片表面平整，不易变形，产出合格率达99.9%以上，本发明烧结方法工艺简单、易操作，适合大批量工业化生产。
Sintering method of piezoresistor ceramic chip
The invention discloses a sintering method of a piezoresistor ceramic chip. The sintering method comprises the steps of (1) preparing roasted particles; (2) preparing a piezoresistor green body; (3) preparing a roasting column; (4) preparing sagger matrix padding; (5) loading the sagger; and (6) sintering the piezoresistor. According to the invention, the roasting column with the same thermal expansion coefficient as the piezoresistor green body is used for supporting an anti-deformation parallel cover plate at high temperature, so that the lower surface of the parallel cover plate and the upper surface of the stacked piezoresistor green body form and always keep a tiny acting force in the sintering process under the condition of synchronous thermal shrinkage in the sintering process, andbending deformation of the surface of the piezoresistor is prevented. The prepared piezoresistor ceramic chip is smooth in surface and not prone to deformation, the yield reaches 99.9% or above, and the sintering method is simple in process, easy to operate and suitable for large-batch industrial production.
本发明公开了一种压敏电阻瓷片的烧结方法，包括以下步骤：（1）制备焙烧颗粒、（2）制备压敏电阻坯体、（3）制备焙烧柱、（4）制备匣钵基体垫料、（5）装载匣钵、（6）烧结压敏电阻。本发明利用与压敏电阻生坯体相同热膨胀系数的焙烧柱支撑高温下防变形的平行盖板，使得在烧结过程中，热收缩同步的情况下，平行盖板下表面与堆叠的压敏电阻生坯体上表面在烧结过程中形成并一直保持一个微小的作用力，阻止压敏电阻表面发生弯曲变形。所制备得的压敏电阻瓷片表面平整，不易变形，产出合格率达99.9%以上，本发明烧结方法工艺简单、易操作，适合大批量工业化生产。
Sintering method of piezoresistor ceramic chip
一种压敏电阻瓷片的烧结方法
ZHU XIAOLING (author) / QIN YUANDONG (author)
2021-02-26
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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