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Ceramic dielectric ceramic powder and preparation method and application thereof
The invention discloses ceramic dielectric ceramic powder and a preparation method and application thereof, the ceramic dielectric ceramic powder is composed of a main material and a modified additive, the main material is BaTiO3, and the modified additive is prepared from the following raw materials: Nb2O5, Co2O3, SiO2 and MnCO3; he addition amounts of the Nb2O5, the Co2O3, the SiO2 and the MnCO3 are respectively 0.3%-2%, 0.3%-1.0%, 0.1%-0.5% and 0.1%-0.3% of the weight of the BaTiO3. A 50mm * 60mm substrate with an embedded MLCC structure capacitor is prepared by an MLCC process, a chip resistor is prepared on the substrate by a thick film printing process, and finally, a resistance-capacitance device is prepared by splitting, end coating and electroplating processes so that the thickness of a product can be remarkably reduced by nearly 50 percent, and the reliability index of a breakdown voltage is improved by 67 percent or above on year-on-year basis. The development requirements of miniaturization and high reliability of electronic components are met, benefits are provided for further improvement of the assembly density of an integrated circuit, and the eramic dielectric ceramic powder is suitable for a micro-assembly process.
本发明公开了一种陶瓷介质瓷粉及其制备方法和应用，陶瓷介质瓷粉，由主材料和改性添加剂组成，主材料为BaTiO3，所述改性添加剂的原料包括Nb2O5、Co2O3、SiO2以及MnCO3；所述Nb2O5、Co2O3、SiO2以及MnCO3的添加量分别为BaTiO3的重量的0.3％～2％、0.3％～1.0％、0.1％～0.5％以及0.1％～0.3％。通过MLCC工艺制备成50mm×60mm的内埋MLCC结构电容的基板，采用厚膜印刷工艺在该基板上制备片式电阻，最后经裂片、端涂、电镀工序后制备成阻容器，可显著缩小产品厚度尺寸近50％，且击穿电压可靠性指标同比提升67％以上，有利于电子元件微型化、高可靠的发展要求，为集成电路组装密度的进一步提高提供助益，且适用于微组装工艺。
Ceramic dielectric ceramic powder and preparation method and application thereof
The invention discloses ceramic dielectric ceramic powder and a preparation method and application thereof, the ceramic dielectric ceramic powder is composed of a main material and a modified additive, the main material is BaTiO3, and the modified additive is prepared from the following raw materials: Nb2O5, Co2O3, SiO2 and MnCO3; he addition amounts of the Nb2O5, the Co2O3, the SiO2 and the MnCO3 are respectively 0.3%-2%, 0.3%-1.0%, 0.1%-0.5% and 0.1%-0.3% of the weight of the BaTiO3. A 50mm * 60mm substrate with an embedded MLCC structure capacitor is prepared by an MLCC process, a chip resistor is prepared on the substrate by a thick film printing process, and finally, a resistance-capacitance device is prepared by splitting, end coating and electroplating processes so that the thickness of a product can be remarkably reduced by nearly 50 percent, and the reliability index of a breakdown voltage is improved by 67 percent or above on year-on-year basis. The development requirements of miniaturization and high reliability of electronic components are met, benefits are provided for further improvement of the assembly density of an integrated circuit, and the eramic dielectric ceramic powder is suitable for a micro-assembly process.
本发明公开了一种陶瓷介质瓷粉及其制备方法和应用，陶瓷介质瓷粉，由主材料和改性添加剂组成，主材料为BaTiO3，所述改性添加剂的原料包括Nb2O5、Co2O3、SiO2以及MnCO3；所述Nb2O5、Co2O3、SiO2以及MnCO3的添加量分别为BaTiO3的重量的0.3％～2％、0.3％～1.0％、0.1％～0.5％以及0.1％～0.3％。通过MLCC工艺制备成50mm×60mm的内埋MLCC结构电容的基板，采用厚膜印刷工艺在该基板上制备片式电阻，最后经裂片、端涂、电镀工序后制备成阻容器，可显著缩小产品厚度尺寸近50％，且击穿电压可靠性指标同比提升67％以上，有利于电子元件微型化、高可靠的发展要求，为集成电路组装密度的进一步提高提供助益，且适用于微组装工艺。
Ceramic dielectric ceramic powder and preparation method and application thereof
一种陶瓷介质瓷粉及其制备方法和应用
HE CHUANGCHUANG (author) / PANG JINBIAO (author) / WANG DANQIN (author) / CHEN CHUANQING (author) / GOU TINGGANG (author) / YANG JUN (author) / CHANG BIN (author) / ZHA YUANHUA (author) / CAO WENYUAN (author)
2021-04-30
Patent
Electronic Resource
Chinese
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