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Silicon nitride-based heating body and preparation process thereof
The invention relates to the technical field of heating body components, in particular to a silicon nitride-based heating body and a preparation process thereof. The preparation method of the heating body comprises the following steps of S1, carrying out cutting, grinding and polishing pretreatment on a silicon nitride substrate, S2, placing the pretreated silicon nitride substrate in a sintering furnace to be sintered in an inert atmosphere, S3, atomizing the reaction liquid through air pressure to form small liquid drops, transferring the small liquid drops to the surface of a preheated silicon nitride substrate through carrier gas, and performing thermal decomposition to form a tin oxide film to coat the surface of the substrate, and S4, carrying out heat treatment on the silicon nitride substrate coated with the tin oxide film to obtain the heating body. According to the silicon nitride-based heating body, the compressive strength reaches up to 1300 MPa, the bearable power density reaches up to 100 W/cm<2> and is far higher than that of a traditional heating body based on a quartz tube, the heating body is fast in reaction and small in size, the material cost is saved, and the heating efficiency is improved.
本发明涉及加热体元器件技术领域，特别涉及一种基于氮化硅的加热体及其制备工艺。本发明加热体制备包括以下步骤：S1、对氮化硅基体进行裁切、打磨抛光预处理；S2、将预处理后的氮化硅基体置于烧结炉中于惰性气氛中进行烧结；S3、将反应液通过气压雾化形成小液滴，小液滴通过运载气体转移至预热的氮化硅基体表面，发生热分解形成氧化锡膜包覆于基体表面；S4、对包覆氧化锡膜后的氮化硅基体进行热处理，即得加热体。本发明基于氮化硅的加热体抗压强度高达1300MPa，可承受功率密度高达100W/cm2，远高于传统基于石英管的加热体，且本发明加热体反应快、体积小，不仅节约了材料成本，而且提高了加热效率。
Silicon nitride-based heating body and preparation process thereof
The invention relates to the technical field of heating body components, in particular to a silicon nitride-based heating body and a preparation process thereof. The preparation method of the heating body comprises the following steps of S1, carrying out cutting, grinding and polishing pretreatment on a silicon nitride substrate, S2, placing the pretreated silicon nitride substrate in a sintering furnace to be sintered in an inert atmosphere, S3, atomizing the reaction liquid through air pressure to form small liquid drops, transferring the small liquid drops to the surface of a preheated silicon nitride substrate through carrier gas, and performing thermal decomposition to form a tin oxide film to coat the surface of the substrate, and S4, carrying out heat treatment on the silicon nitride substrate coated with the tin oxide film to obtain the heating body. According to the silicon nitride-based heating body, the compressive strength reaches up to 1300 MPa, the bearable power density reaches up to 100 W/cm<2> and is far higher than that of a traditional heating body based on a quartz tube, the heating body is fast in reaction and small in size, the material cost is saved, and the heating efficiency is improved.
本发明涉及加热体元器件技术领域，特别涉及一种基于氮化硅的加热体及其制备工艺。本发明加热体制备包括以下步骤：S1、对氮化硅基体进行裁切、打磨抛光预处理；S2、将预处理后的氮化硅基体置于烧结炉中于惰性气氛中进行烧结；S3、将反应液通过气压雾化形成小液滴，小液滴通过运载气体转移至预热的氮化硅基体表面，发生热分解形成氧化锡膜包覆于基体表面；S4、对包覆氧化锡膜后的氮化硅基体进行热处理，即得加热体。本发明基于氮化硅的加热体抗压强度高达1300MPa，可承受功率密度高达100W/cm2，远高于传统基于石英管的加热体，且本发明加热体反应快、体积小，不仅节约了材料成本，而且提高了加热效率。
Silicon nitride-based heating body and preparation process thereof
一种基于氮化硅的加热体及其制备工艺
CAO XIANFENG (author)
2021-05-28
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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