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3D printing ceramic surface copper plating process based on laser activation
The invention discloses a 3D printing ceramic surface copper plating process based on laser activation, and belongs to the technical field of special materials. According to the 3D printing ceramic surface copper plating process based on laser activation, a special-shaped aluminum oxide matrix is prepared by means of the advantages of additive manufacturing, then the surface of the ceramic matrix is activated through laser pretreatment, and finally through a chemical copper plating process, directional controllable metallization of the surface of the ceramic substrate in a three-dimensional shape is achieved at the normal temperature, a compactly-stacked copper layer with high precision and good reproducibility is obtained, the obtained plating layer has satisfactory roughness, excellent binding force and stability and good weldability, the resistivity of the copper layer measured by a four-probe resistance instrument is about 3.1 mohm*cm, and the limit line width of the metal circuit is about 33.2 [mu]m. The process can be widely applied to electronic and radio frequency circuit industries, such as high-power light-emitting diodes (LEDs), integrated circuits, filters and the like.
本发明公开了一种基于激光活化的3D打印陶瓷表面镀铜工艺，属于特种材料技术领域，本发明借助增材制造的优势制备异型氧化铝基体，然后通过激光预处理来“激活”陶瓷基体表面，最后结合化学镀铜工艺，常温下实现三维形状的陶瓷基体表面定向可控的金属化，获得精确度高，复现性好的致密堆积的铜层，得到的镀层具有令人满意的粗糙度、优秀的结合力与稳定性以及良好的可焊性，四探针电阻仪测得铜层的电阻率约为3.1mΩ·cm，金属线路的极限线宽约为33.2μm；可以被广泛应用于电子与射频电路行业，如大功率发光二极管（LED）、集成电路、滤波器等。
3D printing ceramic surface copper plating process based on laser activation
The invention discloses a 3D printing ceramic surface copper plating process based on laser activation, and belongs to the technical field of special materials. According to the 3D printing ceramic surface copper plating process based on laser activation, a special-shaped aluminum oxide matrix is prepared by means of the advantages of additive manufacturing, then the surface of the ceramic matrix is activated through laser pretreatment, and finally through a chemical copper plating process, directional controllable metallization of the surface of the ceramic substrate in a three-dimensional shape is achieved at the normal temperature, a compactly-stacked copper layer with high precision and good reproducibility is obtained, the obtained plating layer has satisfactory roughness, excellent binding force and stability and good weldability, the resistivity of the copper layer measured by a four-probe resistance instrument is about 3.1 mohm*cm, and the limit line width of the metal circuit is about 33.2 [mu]m. The process can be widely applied to electronic and radio frequency circuit industries, such as high-power light-emitting diodes (LEDs), integrated circuits, filters and the like.
本发明公开了一种基于激光活化的3D打印陶瓷表面镀铜工艺，属于特种材料技术领域，本发明借助增材制造的优势制备异型氧化铝基体，然后通过激光预处理来“激活”陶瓷基体表面，最后结合化学镀铜工艺，常温下实现三维形状的陶瓷基体表面定向可控的金属化，获得精确度高，复现性好的致密堆积的铜层，得到的镀层具有令人满意的粗糙度、优秀的结合力与稳定性以及良好的可焊性，四探针电阻仪测得铜层的电阻率约为3.1mΩ·cm，金属线路的极限线宽约为33.2μm；可以被广泛应用于电子与射频电路行业，如大功率发光二极管（LED）、集成电路、滤波器等。
3D printing ceramic surface copper plating process based on laser activation
一种基于激光活化的3D打印陶瓷表面镀铜工艺
2021-08-06
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
/
B33Y
ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
,
Additive (generative) Fertigung, d. h. die Herstellung von dreidimensionalen [3D] Bauteilen durch additive Abscheidung, additive Agglomeration oder additive Schichtung, z. B. durch 3D- Drucken, Stereolithografie oder selektives Lasersintern
LASER ACTIVATION-BASED COPPER PLATING PROCESS FOR 3D-PRINTED CERAMIC SURFACE
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