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Environment-friendly copper plating process for aluminum oxide ceramic substrate
An environment-friendly copper plating process for an aluminum oxide ceramic substrate comprises the following steps that S1, the aluminum oxide ceramic substrate is prepared through a DLP forming method; s2, carrying out laser pre-activation treatment on the aluminum oxide ceramic substrate; and S3, the aluminum oxide ceramic substrate obtained after laser pre-activation treatment is immersed in a plating solution for chemical copper plating for 20-40 min, and the plating solution for chemical copper plating comprises 15-20 g/L of copper sulfate, 50-60 g/L of sodium potassium tartrate tetrahydrate, 0.1-0.5 g/L of potassium ferrocyanide, 10-20 mL/L of formaldehyde and 40-50 mL/L of methyl alcohol. According to the environment-friendly copper plating process for the aluminum oxide ceramic substrate, the design is reasonable, the aluminum oxide ceramic substrate is prepared through a DLP photocuring forming method, laser pre-activation treatment is conducted before copper plating of the aluminum oxide ceramic substrate to change the microstructure and surface activity of the surface of the aluminum oxide ceramic substrate, controllability is higher, operation is simpler, the production speed is higher, and the process is more environmentally friendly; and the copper plating effect is good, a copper layer is uniform and flat, stability and durability are good, and the application prospect is wide.
一种氧化铝陶瓷基板环保镀铜工艺，包括如下步骤：S1：通过DLP成形方法制备氧化铝陶瓷基板；S2：对所述氧化铝陶瓷基板进行激光预活化处理；S3：将激光预活化处理后的氧化铝陶瓷基板浸入镀液中进行化学镀铜，时间为20‑40min，所述化学镀铜的镀液包括如下成分：硫酸铜15‑20g/L、酒石酸钾钠50‑60 g/L、亚铁氰化钾0.1‑0.5g/L、甲醛10‑20mL/L、甲醇40‑50 mL/L。本发明所述的氧化铝陶瓷基板环保镀铜工艺，设计合理，采用DLP光固化成形方法制备氧化铝陶瓷基板，在氧化铝陶瓷基板镀铜前先进行激光预活化处理改变其表面的微观形貌及表面活性，可控性更强、操作更简单、生产速度更快、更环保，具有良好的镀铜效果，铜层均匀、平整、稳定性和持久性较好，应用前景广泛。
Environment-friendly copper plating process for aluminum oxide ceramic substrate
An environment-friendly copper plating process for an aluminum oxide ceramic substrate comprises the following steps that S1, the aluminum oxide ceramic substrate is prepared through a DLP forming method; s2, carrying out laser pre-activation treatment on the aluminum oxide ceramic substrate; and S3, the aluminum oxide ceramic substrate obtained after laser pre-activation treatment is immersed in a plating solution for chemical copper plating for 20-40 min, and the plating solution for chemical copper plating comprises 15-20 g/L of copper sulfate, 50-60 g/L of sodium potassium tartrate tetrahydrate, 0.1-0.5 g/L of potassium ferrocyanide, 10-20 mL/L of formaldehyde and 40-50 mL/L of methyl alcohol. According to the environment-friendly copper plating process for the aluminum oxide ceramic substrate, the design is reasonable, the aluminum oxide ceramic substrate is prepared through a DLP photocuring forming method, laser pre-activation treatment is conducted before copper plating of the aluminum oxide ceramic substrate to change the microstructure and surface activity of the surface of the aluminum oxide ceramic substrate, controllability is higher, operation is simpler, the production speed is higher, and the process is more environmentally friendly; and the copper plating effect is good, a copper layer is uniform and flat, stability and durability are good, and the application prospect is wide.
一种氧化铝陶瓷基板环保镀铜工艺，包括如下步骤：S1：通过DLP成形方法制备氧化铝陶瓷基板；S2：对所述氧化铝陶瓷基板进行激光预活化处理；S3：将激光预活化处理后的氧化铝陶瓷基板浸入镀液中进行化学镀铜，时间为20‑40min，所述化学镀铜的镀液包括如下成分：硫酸铜15‑20g/L、酒石酸钾钠50‑60 g/L、亚铁氰化钾0.1‑0.5g/L、甲醛10‑20mL/L、甲醇40‑50 mL/L。本发明所述的氧化铝陶瓷基板环保镀铜工艺，设计合理，采用DLP光固化成形方法制备氧化铝陶瓷基板，在氧化铝陶瓷基板镀铜前先进行激光预活化处理改变其表面的微观形貌及表面活性，可控性更强、操作更简单、生产速度更快、更环保，具有良好的镀铜效果，铜层均匀、平整、稳定性和持久性较好，应用前景广泛。
Environment-friendly copper plating process for aluminum oxide ceramic substrate
一种氧化铝陶瓷基板环保镀铜工艺
ZHI JIANMING (author)
2024-04-09
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
/
B33Y
ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
,
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