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Dielectric device metallization silvering method and dielectric device
The invention provides a dielectric device metallization silvering method and a dielectric device. The dielectric device is prepared by adopting the dielectric device metallization silvering method. The silvering method comprises the following steps: performing one-time silver spraying on a blind hole, a through hole and a groove, and then passing through a furnace in a silver drying furnace; performing primary silver spraying on a port hole, and then performing furnace passing in the silver drying furnace; performing secondary silver spraying on the blind hole, the through hole and the groove, performing secondary silver spraying on the port hole, performing silver spraying on the time delay surface, and drying the time delay surface in the furnace; wiping the residual silver layer part of the frequency surface, and then sintering in a silver sintering furnace to enable the silver layer to be half-cooked; and spraying silver on other surfaces of the dielectric device except the time delay surface, wiping after drying, and then carrying out silver layer sintering in a silver sintering furnace to finish silvering of the dielectric device. The silver coating process can be greatly simplified, the silver coating period of the dielectric device is shortened, the waste of silver paste is reduced, the cost is greatly saved, the silver coating technology of the 5G dielectric device is optimized, and the method has great significance on actual production.
本发明提供了一种介质器件金属化被银方法及介质器件，介质器件采用该介质器件金属化被银方法制备，其中被银方法包括：将盲孔、通孔和沟槽一次喷银，然后于烘银炉中过炉；将端口孔一次喷银，然后于烘银炉中过炉；将盲孔、通孔和沟槽二次喷银，再将端口孔二次喷银，然后对时延面进行喷银，过炉烘干；将频率面残留银层部分进行擦拭，然后于烧银炉中烧渗，使银层处于半熟；对除时延面的介质器件的其他面喷银，烘干后擦拭，然后于烧银炉中进行银层烧渗，完成介质器件被银。本发明能够极大地简化被银工序，缩短介质器件被银周期，且减少了银浆的浪费，更大的节约了成本，优化了5G介质器件被银技术，对实际生产意义很大。
Dielectric device metallization silvering method and dielectric device
The invention provides a dielectric device metallization silvering method and a dielectric device. The dielectric device is prepared by adopting the dielectric device metallization silvering method. The silvering method comprises the following steps: performing one-time silver spraying on a blind hole, a through hole and a groove, and then passing through a furnace in a silver drying furnace; performing primary silver spraying on a port hole, and then performing furnace passing in the silver drying furnace; performing secondary silver spraying on the blind hole, the through hole and the groove, performing secondary silver spraying on the port hole, performing silver spraying on the time delay surface, and drying the time delay surface in the furnace; wiping the residual silver layer part of the frequency surface, and then sintering in a silver sintering furnace to enable the silver layer to be half-cooked; and spraying silver on other surfaces of the dielectric device except the time delay surface, wiping after drying, and then carrying out silver layer sintering in a silver sintering furnace to finish silvering of the dielectric device. The silver coating process can be greatly simplified, the silver coating period of the dielectric device is shortened, the waste of silver paste is reduced, the cost is greatly saved, the silver coating technology of the 5G dielectric device is optimized, and the method has great significance on actual production.
本发明提供了一种介质器件金属化被银方法及介质器件，介质器件采用该介质器件金属化被银方法制备，其中被银方法包括：将盲孔、通孔和沟槽一次喷银，然后于烘银炉中过炉；将端口孔一次喷银，然后于烘银炉中过炉；将盲孔、通孔和沟槽二次喷银，再将端口孔二次喷银，然后对时延面进行喷银，过炉烘干；将频率面残留银层部分进行擦拭，然后于烧银炉中烧渗，使银层处于半熟；对除时延面的介质器件的其他面喷银，烘干后擦拭，然后于烧银炉中进行银层烧渗，完成介质器件被银。本发明能够极大地简化被银工序，缩短介质器件被银周期，且减少了银浆的浪费，更大的节约了成本，优化了5G介质器件被银技术，对实际生产意义很大。
Dielectric device metallization silvering method and dielectric device
一种介质器件金属化被银方法及介质器件
HUANG MINGZHENG (author) / WANG XIUHONG (author) / YE RONG (author) / HUANG QINGHUAN (author) / GU GUOZHI (author)
2021-08-06
Patent
Electronic Resource
Chinese
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