A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Inorganic lightweight aggregate thermal insulation board with surface enhancement layer and preparation method of inorganic lightweight aggregate thermal insulation board
The invention belongs to the technical field of building materials, and discloses an inorganic lightweight aggregate thermal insulation board with surface enhancement layers. The inorganic lightweight aggregate thermal insulation board comprises two enhancement layers and a thermal insulation layer, wherein the number of the enhancement layers is two, the enhancement layers are completely consistent in structure, the thermal insulation layer is located between the two enhancement layers, and the sum of the thickness values of the two enhancement layers is smaller than the thickness value of the thermal insulation layer. According to the inorganic lightweight aggregate thermal insulation board with the enhancement layers on the surface, the enhancement layer is composed of the polymer modified cement mortar material, the compressive strength of the polymer modified cement mortar material can reach 15 Mpa or above, and the breaking strength of the polymer modified cement mortar material can reach 5 Mpa or above, so that the surface strength of the thermal insulation board can be remarkably improved by adding the surface enhancement layer, the defect that the surface layer is easy to peel off when the surface layer is dried and shrunk by adhesive mortar or adhesive when the surface layer is used is overcome, and firm bonding of a thin plaster thermal insulation system taking the inorganic lightweight aggregate thermal insulation board as a thermal insulation layer or a thermal insulation decorative board taking the inorganic lightweight aggregate thermal insulation board as a thermal insulation core material is ensured.
本发明属于建筑材料技术领域，且公开了一种带表面增强层的无机轻集料保温板，包括增强层与保温层，所述增强层的数量为两个且二者结构完全一致，所述保温层位于两个增强层的中部且两个增强层的厚度值之和均小于保温层的厚度值。本发明提出一种表面带有增强层的无机轻集料保温板，其增强层由聚合物改性水泥砂浆材料组成，由于聚合物改性水泥砂浆材料抗压强度可高达15Mpa以上，抗折强度可高达5Mpa以上，因此添加表面增强层能够显著增加保温板表面强度，克服其使用时易被粘结砂浆或粘结胶干燥收缩时剥落表皮的缺点，保证以其作为保温层的薄抹灰保温系统或以其作为保温芯材的保温装饰板粘结牢靠。
Inorganic lightweight aggregate thermal insulation board with surface enhancement layer and preparation method of inorganic lightweight aggregate thermal insulation board
The invention belongs to the technical field of building materials, and discloses an inorganic lightweight aggregate thermal insulation board with surface enhancement layers. The inorganic lightweight aggregate thermal insulation board comprises two enhancement layers and a thermal insulation layer, wherein the number of the enhancement layers is two, the enhancement layers are completely consistent in structure, the thermal insulation layer is located between the two enhancement layers, and the sum of the thickness values of the two enhancement layers is smaller than the thickness value of the thermal insulation layer. According to the inorganic lightweight aggregate thermal insulation board with the enhancement layers on the surface, the enhancement layer is composed of the polymer modified cement mortar material, the compressive strength of the polymer modified cement mortar material can reach 15 Mpa or above, and the breaking strength of the polymer modified cement mortar material can reach 5 Mpa or above, so that the surface strength of the thermal insulation board can be remarkably improved by adding the surface enhancement layer, the defect that the surface layer is easy to peel off when the surface layer is dried and shrunk by adhesive mortar or adhesive when the surface layer is used is overcome, and firm bonding of a thin plaster thermal insulation system taking the inorganic lightweight aggregate thermal insulation board as a thermal insulation layer or a thermal insulation decorative board taking the inorganic lightweight aggregate thermal insulation board as a thermal insulation core material is ensured.
本发明属于建筑材料技术领域，且公开了一种带表面增强层的无机轻集料保温板，包括增强层与保温层，所述增强层的数量为两个且二者结构完全一致，所述保温层位于两个增强层的中部且两个增强层的厚度值之和均小于保温层的厚度值。本发明提出一种表面带有增强层的无机轻集料保温板，其增强层由聚合物改性水泥砂浆材料组成，由于聚合物改性水泥砂浆材料抗压强度可高达15Mpa以上，抗折强度可高达5Mpa以上，因此添加表面增强层能够显著增加保温板表面强度，克服其使用时易被粘结砂浆或粘结胶干燥收缩时剥落表皮的缺点，保证以其作为保温层的薄抹灰保温系统或以其作为保温芯材的保温装饰板粘结牢靠。
Inorganic lightweight aggregate thermal insulation board with surface enhancement layer and preparation method of inorganic lightweight aggregate thermal insulation board
一种带表面增强层的无机轻集料保温板及其制备方法
LI HUI (author) / JIN DONGCHEN (author) / GE FUXING (author) / CHEN GANG (author)
2021-09-17
Patent
Electronic Resource
Chinese
Inorganic lightweight aggregate thermal insulation board and preparation method thereof
| European Patent Office | 2015
Preparation method of inorganic lightweight aggregate insulation board
| European Patent Office | 2020
Preparation method of inorganic lightweight aggregate insulation board for building
| European Patent Office | 2023
Inorganic-organic lightweight aggregate aerogel composite thermal insulation material
| European Patent Office | 2023
| European Patent Office | 2022