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LTCC substrate as well as preparation method and application thereof
The invention discloses an LTCC substrate as well as a preparation method and application thereof. The preparation method comprises the following steps: 1) carrying out ball milling on hollow spherical SiO2 and Al2O3, and calcining to obtain SiO2@Al2O3 powder; 2) mixing KBS glass powder, the SiO2@Al2O3 powder and an additive, and carrying out ball milling to obtain ceramic slurry; (3) forming the ceramic slurry, laminating membranes, carrying out isostatic pressing, and cutting into a ceramic blank; and 4) sintering the ceramic blank to obtain the LTCC substrate. By adding the hollow spherical SiO2, the dielectric constant of the LTCC ceramic is reduced, the dielectric constant of the material is as low as 3.5, and the dielectric loss is as low as 0.2%; and the surface of the hollow spherical SiO2 is coated with Al2O3, the surface binding force of glass and SiO2 in the sintering process is improved, the strength of the substrate is improved to 220 MPa, and the ultralow dielectric constant LTCC substrate which is good in compactness and high in bending strength is obtained and is suitable for the fields of high-frequency communication and radio frequency.
本发明公开了一种LTCC基板及其制备方法与应用。制备方法包括以下步骤：1)将中空球形SiO2与Al2O3球磨，煅烧，得到SiO2@Al2O3粉体；2)将KBS玻璃粉、SiO2@Al2O3粉体及添加剂混合，球磨，得到陶瓷浆料；3)将陶瓷浆料成型，膜片叠层，等静压，切割成陶瓷坯体；4)陶瓷坯体烧结，得到LTCC基板。通过添加中空球形SiO2，降低LTCC陶瓷介电常数，材料介电常数低至3.5，介电损耗低至0.2％；中空球形SiO2表面包覆Al2O3，提高烧结过程中玻璃与SiO2的表面结合力，提高基板强度至220MPa，得到致密性良好且弯曲强度较高的超低介电常数LTCC基板，适用于高频通讯及射频领域。
LTCC substrate as well as preparation method and application thereof
The invention discloses an LTCC substrate as well as a preparation method and application thereof. The preparation method comprises the following steps: 1) carrying out ball milling on hollow spherical SiO2 and Al2O3, and calcining to obtain SiO2@Al2O3 powder; 2) mixing KBS glass powder, the SiO2@Al2O3 powder and an additive, and carrying out ball milling to obtain ceramic slurry; (3) forming the ceramic slurry, laminating membranes, carrying out isostatic pressing, and cutting into a ceramic blank; and 4) sintering the ceramic blank to obtain the LTCC substrate. By adding the hollow spherical SiO2, the dielectric constant of the LTCC ceramic is reduced, the dielectric constant of the material is as low as 3.5, and the dielectric loss is as low as 0.2%; and the surface of the hollow spherical SiO2 is coated with Al2O3, the surface binding force of glass and SiO2 in the sintering process is improved, the strength of the substrate is improved to 220 MPa, and the ultralow dielectric constant LTCC substrate which is good in compactness and high in bending strength is obtained and is suitable for the fields of high-frequency communication and radio frequency.
本发明公开了一种LTCC基板及其制备方法与应用。制备方法包括以下步骤：1)将中空球形SiO2与Al2O3球磨，煅烧，得到SiO2@Al2O3粉体；2)将KBS玻璃粉、SiO2@Al2O3粉体及添加剂混合，球磨，得到陶瓷浆料；3)将陶瓷浆料成型，膜片叠层，等静压，切割成陶瓷坯体；4)陶瓷坯体烧结，得到LTCC基板。通过添加中空球形SiO2，降低LTCC陶瓷介电常数，材料介电常数低至3.5，介电损耗低至0.2％；中空球形SiO2表面包覆Al2O3，提高烧结过程中玻璃与SiO2的表面结合力，提高基板强度至220MPa，得到致密性良好且弯曲强度较高的超低介电常数LTCC基板，适用于高频通讯及射频领域。
LTCC substrate as well as preparation method and application thereof
一种LTCC基板及其制备方法与应用
CHEN TAO (author) / HUANG GUOHONG (author) / CUI SANCHUAN (author) / CAO XIUHUA (author) / TA SHIWO (author) / FU ZHENXIAO (author)
2021-09-21
Patent
Electronic Resource
Chinese
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