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LTCC substrate sacrificial material, preparation method and application thereof
The invention relates to the technical field of hybrid circuits, in particular to an LTCC substrate sacrificial material, a preparation method and application thereof. The preparation method comprises the steps: taking polytetrafluoroethylene, polyvinyl alcohol and polycarbonate ball-milled powder as a functional solid phase, and mixing and stirring the functional solid phase and an organic solvent with specific components in proportion to prepare a precursor slurry of a sacrificial material for use; drying the precursor slurry, and rolling the precursor slurry multiple times by using a double-roller press to obtain a flaky sacrificial material with a certain thickness; according to the shape of an LTCC embedded cavity, cutting the flaky sacrificial material into a specific shape by adopting ultraviolet laser, and then filling the inner cavity with the flaky sacrificial material to prepare an LTCC green body according to a conventional process; and finally, burning off the sacrificial material in the embedded cavity in a sintering furnace by using specific temperature and atmosphere. According to the invention, the sacrificial material prepared by the method is good in supporting effect and small in burning allowance in the LTCC cavity; and the material has the advantages of wide burn-off temperature range, uniform gas displacement, simple preparation process and wide application range, and the burn-off temperature can be matched with the sintering curve of the LTCC substrate.
本发明涉及混合电路技术领域，具体涉及一种LTCC基板牺牲材料、制备方法及其应用，首先使用聚四氟乙烯、聚乙烯醇、聚碳酸酯球磨粉体作为功能固相，与特定成分的有机溶剂按比例混合搅拌后配置成牺牲材料的前驱浆料备用；然后将前驱浆料烘干后使用双辊压机多次辊压，压制成一定厚度的片状牺牲材料；根据LTCC内埋腔体形状，采用紫外激光将片状牺牲材料切割成特定形状，然后填入内腔体中按常规工艺制备成LTCC生坯；最后在烧结炉中使用特定温度和气氛烧除内埋腔体中的牺牲材料，本发明方法制备的牺牲材料在LTCC腔体中支撑效果好，烧余量小；而且材料烧除温度范围宽、排气量均匀，烧除温度可以与LTCC基板烧结曲线匹配，制备工艺简单，适用范围广。
LTCC substrate sacrificial material, preparation method and application thereof
The invention relates to the technical field of hybrid circuits, in particular to an LTCC substrate sacrificial material, a preparation method and application thereof. The preparation method comprises the steps: taking polytetrafluoroethylene, polyvinyl alcohol and polycarbonate ball-milled powder as a functional solid phase, and mixing and stirring the functional solid phase and an organic solvent with specific components in proportion to prepare a precursor slurry of a sacrificial material for use; drying the precursor slurry, and rolling the precursor slurry multiple times by using a double-roller press to obtain a flaky sacrificial material with a certain thickness; according to the shape of an LTCC embedded cavity, cutting the flaky sacrificial material into a specific shape by adopting ultraviolet laser, and then filling the inner cavity with the flaky sacrificial material to prepare an LTCC green body according to a conventional process; and finally, burning off the sacrificial material in the embedded cavity in a sintering furnace by using specific temperature and atmosphere. According to the invention, the sacrificial material prepared by the method is good in supporting effect and small in burning allowance in the LTCC cavity; and the material has the advantages of wide burn-off temperature range, uniform gas displacement, simple preparation process and wide application range, and the burn-off temperature can be matched with the sintering curve of the LTCC substrate.
本发明涉及混合电路技术领域，具体涉及一种LTCC基板牺牲材料、制备方法及其应用，首先使用聚四氟乙烯、聚乙烯醇、聚碳酸酯球磨粉体作为功能固相，与特定成分的有机溶剂按比例混合搅拌后配置成牺牲材料的前驱浆料备用；然后将前驱浆料烘干后使用双辊压机多次辊压，压制成一定厚度的片状牺牲材料；根据LTCC内埋腔体形状，采用紫外激光将片状牺牲材料切割成特定形状，然后填入内腔体中按常规工艺制备成LTCC生坯；最后在烧结炉中使用特定温度和气氛烧除内埋腔体中的牺牲材料，本发明方法制备的牺牲材料在LTCC腔体中支撑效果好，烧余量小；而且材料烧除温度范围宽、排气量均匀，烧除温度可以与LTCC基板烧结曲线匹配，制备工艺简单，适用范围广。
LTCC substrate sacrificial material, preparation method and application thereof
一种LTCC基板牺牲材料、制备方法及其应用
ZHANG KONG (author) / LIU JIANJUN (author) / LIU GANG (author) / HU HAILIN (author) / WEI XIAOMIN (author)
2022-01-28
Patent
Electronic Resource
Chinese
IPC:
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
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