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Preparation method of ceramic aluminum-coated lining plate
The invention relates to the technical field of semiconductors. The invention relates to a preparation method of a ceramic aluminum-coated lining plate, which is characterized by comprising the following steps of: 1, preparing aluminum alloy metal slurry, coating the slurry on a ceramic substrate by adopting a silk-screen printing process, and conducting drying; 2, conducting high-temperature wettability sintering, specifically carrying out high-temperature wettability sintering in a vacuum or protective atmosphere to form a uniform aluminum alloy metallization layer on the ceramic substrate; and 3, conducting low-temperature direct brazing, specifically, attaching the prepared ceramic substrate with the aluminum alloy metallization layer to a high-purity aluminum foil, and conducting direct brazing welding. After the slurry layer is sintered at a high temperature, an alloy metallization layer which is low in melting point, good in uniformity, good in wettability and high in bonding strength can be formed on the ceramic substrate; and direct brazing belongs to the brazing process of the aluminum alloy metallization layer and the high-purity aluminum foil, and the wettability of the original aluminum alloy metallization layer and the ceramic substrate cannot be damaged in the process. The product is high in yield, low in cost and suitable for mass production.
本发明涉及半导体技术领域。一种陶瓷覆铝衬板的制备方法，其特征在于，包括以下步骤：步骤一，铝合金金属浆料配置，采用丝网印刷工艺将浆料涂覆在陶瓷基板上，烘干；步骤二，高温浸润性烧结：采用真空或保护气氛进行高温浸润性烧结，在陶瓷基板上形成均匀的铝合金金属化层；步骤三，低温直接钎焊：将制备带铝合金金属化层的陶瓷基板与高纯铝箔进行贴合，直接钎焊焊接。浆料层经高温烧结后，可在陶瓷基板上，形成低熔点、均匀性好、润湿性好、粘结强度高的合金金属化层；直接钎焊属于铝合金金属化层与高纯铝箔的钎焊过程，该过程不会破坏原始铝合金金属化层与陶瓷基板的润湿性。产品良率高，成本较低，适合大量生产。
Preparation method of ceramic aluminum-coated lining plate
The invention relates to the technical field of semiconductors. The invention relates to a preparation method of a ceramic aluminum-coated lining plate, which is characterized by comprising the following steps of: 1, preparing aluminum alloy metal slurry, coating the slurry on a ceramic substrate by adopting a silk-screen printing process, and conducting drying; 2, conducting high-temperature wettability sintering, specifically carrying out high-temperature wettability sintering in a vacuum or protective atmosphere to form a uniform aluminum alloy metallization layer on the ceramic substrate; and 3, conducting low-temperature direct brazing, specifically, attaching the prepared ceramic substrate with the aluminum alloy metallization layer to a high-purity aluminum foil, and conducting direct brazing welding. After the slurry layer is sintered at a high temperature, an alloy metallization layer which is low in melting point, good in uniformity, good in wettability and high in bonding strength can be formed on the ceramic substrate; and direct brazing belongs to the brazing process of the aluminum alloy metallization layer and the high-purity aluminum foil, and the wettability of the original aluminum alloy metallization layer and the ceramic substrate cannot be damaged in the process. The product is high in yield, low in cost and suitable for mass production.
本发明涉及半导体技术领域。一种陶瓷覆铝衬板的制备方法，其特征在于，包括以下步骤：步骤一，铝合金金属浆料配置，采用丝网印刷工艺将浆料涂覆在陶瓷基板上，烘干；步骤二，高温浸润性烧结：采用真空或保护气氛进行高温浸润性烧结，在陶瓷基板上形成均匀的铝合金金属化层；步骤三，低温直接钎焊：将制备带铝合金金属化层的陶瓷基板与高纯铝箔进行贴合，直接钎焊焊接。浆料层经高温烧结后，可在陶瓷基板上，形成低熔点、均匀性好、润湿性好、粘结强度高的合金金属化层；直接钎焊属于铝合金金属化层与高纯铝箔的钎焊过程，该过程不会破坏原始铝合金金属化层与陶瓷基板的润湿性。产品良率高，成本较低，适合大量生产。
Preparation method of ceramic aluminum-coated lining plate
一种陶瓷覆铝衬板的制备方法
WANG BIN (author) / HE XIANHAN (author) / OUYANG PENG (author) / GUO JIANYUE (author) / ZHANG ENRONG (author)
2021-10-19
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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