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Sound wave processing structure and device and preparation method of sound wave processing structure
The invention discloses a sound wave processing structure and device and a preparation method. The structure comprises a bottom plate and a plurality of protruding structures arranged on one side of the bottom plate, each protruding structure comprises a plurality of structural units, the structural units are distributed in the direction parallel to the bottom plate, each structural unit comprises a plurality of structural plates and two partition plates, and the structural plates are parallel to the bottom plate; and the structural plates and the bottom plate are arranged at intervals, the partition plates are perpendicular to the bottom plate, the multiple structural plates are sequentially arranged at intervals in the direction perpendicular to the bottom plate, the two partition plates are arranged in parallel at intervals, the multiple structural plates are arranged between the two partition plates, the two ends of each structural plate are connected with the partition plates respectively, each structural plate is provided with a slit or a through hole, and the slits or the through holes penetrate through the structural plates. According to the sound wave processing structure, the volume of a scatterer can be reduced exponentially, the diffusion property of sound waves is kept, and the space utilization rate is increased. The base plate is made of porous materials and can adjust the space distance between the bottom plate and the to-be-installed face in cooperation with an adjusting piece and the like, and the good sound wave absorption effect is achieved.
本发明公开一种声波处理结构及其装置和制备方法,结构包括底板和设于其一侧的若干凸起结构,凸起结构包括若干结构单元,若干结构单元沿平行底板方向分布,结构单元内包括若干结构板和两隔板,结构板与底板平行,结构板与底板间隔设置,隔板与底板垂直,若干结构板沿垂直底板方向依次间隔设置,两隔板平行间隔设置,若干结构板设于两隔板之间,结构板的两端分别与隔板连接,每个结构板上设置有狭缝或通孔,狭缝或通孔贯穿结构板。本发明的声波处理结构能够成倍的减小散射体体积并保持其声波的扩散性质,提升空间利用率。底板采集多孔材质并配合调节件等能够调节与待安装面之间的空间距离,使其还具有良好的声波吸收效果。
Sound wave processing structure and device and preparation method of sound wave processing structure
The invention discloses a sound wave processing structure and device and a preparation method. The structure comprises a bottom plate and a plurality of protruding structures arranged on one side of the bottom plate, each protruding structure comprises a plurality of structural units, the structural units are distributed in the direction parallel to the bottom plate, each structural unit comprises a plurality of structural plates and two partition plates, and the structural plates are parallel to the bottom plate; and the structural plates and the bottom plate are arranged at intervals, the partition plates are perpendicular to the bottom plate, the multiple structural plates are sequentially arranged at intervals in the direction perpendicular to the bottom plate, the two partition plates are arranged in parallel at intervals, the multiple structural plates are arranged between the two partition plates, the two ends of each structural plate are connected with the partition plates respectively, each structural plate is provided with a slit or a through hole, and the slits or the through holes penetrate through the structural plates. According to the sound wave processing structure, the volume of a scatterer can be reduced exponentially, the diffusion property of sound waves is kept, and the space utilization rate is increased. The base plate is made of porous materials and can adjust the space distance between the bottom plate and the to-be-installed face in cooperation with an adjusting piece and the like, and the good sound wave absorption effect is achieved.
本发明公开一种声波处理结构及其装置和制备方法,结构包括底板和设于其一侧的若干凸起结构,凸起结构包括若干结构单元,若干结构单元沿平行底板方向分布,结构单元内包括若干结构板和两隔板,结构板与底板平行,结构板与底板间隔设置,隔板与底板垂直,若干结构板沿垂直底板方向依次间隔设置,两隔板平行间隔设置,若干结构板设于两隔板之间,结构板的两端分别与隔板连接,每个结构板上设置有狭缝或通孔,狭缝或通孔贯穿结构板。本发明的声波处理结构能够成倍的减小散射体体积并保持其声波的扩散性质,提升空间利用率。底板采集多孔材质并配合调节件等能够调节与待安装面之间的空间距离,使其还具有良好的声波吸收效果。
Sound wave processing structure and device and preparation method of sound wave processing structure
一种声波处理结构及其装置和制备方法
ZUO HONGYUN (author) / BI YAFENG (author)
2021-10-22
Patent
Electronic Resource
Chinese
European Patent Office | 2023
|European Patent Office | 2023
|Engineering Index Backfile | 1936
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