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Provided is a sound processing assembly structure, comprising: a sound absorbing panel in which a first panel and a second panel wherein a plurality of first sound absorbing holes and second sound absorbing holes are formed, respectively, are mounted so as to be movable in the vertical or horizontal direction; a porous sound absorbing material interposed between the first panel and the second panel; and an acoustic panel disposed in close contact with one surface of the sound absorbing panel. An objective of the present invention is to provide the sound assisting assembly structure with excellent space utilization.
본 발명은, 다수의 제1 흡음공과 제2 흡음공이 각각 형성된 제1 패널과 제2 패널이 상호 상하 또는 좌우 방향으로 이동 가능하게 장착되는 흡음패널, 상기 제1 패널과 제2 패널 사이에 개재되는 다공성 흡음재 및 상기 흡음패널의 일면에 밀착되어 배치되는 음향패널을 포함하는 음향처리 어셈블리 구조체를 제공한다.
Provided is a sound processing assembly structure, comprising: a sound absorbing panel in which a first panel and a second panel wherein a plurality of first sound absorbing holes and second sound absorbing holes are formed, respectively, are mounted so as to be movable in the vertical or horizontal direction; a porous sound absorbing material interposed between the first panel and the second panel; and an acoustic panel disposed in close contact with one surface of the sound absorbing panel. An objective of the present invention is to provide the sound assisting assembly structure with excellent space utilization.
본 발명은, 다수의 제1 흡음공과 제2 흡음공이 각각 형성된 제1 패널과 제2 패널이 상호 상하 또는 좌우 방향으로 이동 가능하게 장착되는 흡음패널, 상기 제1 패널과 제2 패널 사이에 개재되는 다공성 흡음재 및 상기 흡음패널의 일면에 밀착되어 배치되는 음향패널을 포함하는 음향처리 어셈블리 구조체를 제공한다.
ASSEMBLY STRUCTURE FOR SOUND PROCESSING
음향처리 어셈블리 구조체
CHOI JIN HO (author)
2022-11-29
Patent
Electronic Resource
Korean
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