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Method for metallizing surface of ceramic dielectric substrate, and ceramic dielectric substrate
The invention provides a method for metallizing the surface of a ceramic dielectric substrate, and the ceramic dielectric substrate. The method comprises the following steps: A, grinding and/or polishing an original ceramic dielectric substrate body in sequence; B, preprocessing the ceramic dielectric substrate body after the step A; C, performing ultrasonic cleaning on the sintered ceramic dielectric substrate body by using an acetone solution, alcohol, a subacid cleaning solution and deionized water in sequence so as to remove oil stains and dust on the surface of the ceramic dielectric substrate body; and D, depositing metal on the surface of the ceramic dielectric substrate body by using a magnetron sputtering process to form a metal film layer so as to obtain the final ceramic dielectric substrate. The strength of the metal film layer can be remarkably improved, peeling and stripping of the metalized film layer are avoided, the qualified rate of products is effectively increased, operation is easy, and extra cost is basically not increased.
本发明提供一种在陶瓷介质基板表面金属化的方法及陶瓷介质基板，方法包括如下步骤：A、依次对原始陶瓷介质基板本体进行研磨和/或抛光；B、对经步骤A后的陶瓷介质基板本体进行预处理；C、对烧结后的陶瓷介质基板本体依次利用丙酮溶液、酒精、微酸性清洗液和去离子水进行超声波清洗，以去除陶瓷介质基板本体表面的油污和灰尘；D、利用磁控溅射工艺使金属沉积在陶瓷介质基板本体表面，形成金属膜层，得到最终的陶瓷介质基板。本发明能够显著提高金属膜层的强度，杜绝金属化膜层起皮、剥落的情况，从而有效提高产品的合格率，且操作简单，基本不会增加额外的成本。
Method for metallizing surface of ceramic dielectric substrate, and ceramic dielectric substrate
The invention provides a method for metallizing the surface of a ceramic dielectric substrate, and the ceramic dielectric substrate. The method comprises the following steps: A, grinding and/or polishing an original ceramic dielectric substrate body in sequence; B, preprocessing the ceramic dielectric substrate body after the step A; C, performing ultrasonic cleaning on the sintered ceramic dielectric substrate body by using an acetone solution, alcohol, a subacid cleaning solution and deionized water in sequence so as to remove oil stains and dust on the surface of the ceramic dielectric substrate body; and D, depositing metal on the surface of the ceramic dielectric substrate body by using a magnetron sputtering process to form a metal film layer so as to obtain the final ceramic dielectric substrate. The strength of the metal film layer can be remarkably improved, peeling and stripping of the metalized film layer are avoided, the qualified rate of products is effectively increased, operation is easy, and extra cost is basically not increased.
本发明提供一种在陶瓷介质基板表面金属化的方法及陶瓷介质基板，方法包括如下步骤：A、依次对原始陶瓷介质基板本体进行研磨和/或抛光；B、对经步骤A后的陶瓷介质基板本体进行预处理；C、对烧结后的陶瓷介质基板本体依次利用丙酮溶液、酒精、微酸性清洗液和去离子水进行超声波清洗，以去除陶瓷介质基板本体表面的油污和灰尘；D、利用磁控溅射工艺使金属沉积在陶瓷介质基板本体表面，形成金属膜层，得到最终的陶瓷介质基板。本发明能够显著提高金属膜层的强度，杜绝金属化膜层起皮、剥落的情况，从而有效提高产品的合格率，且操作简单，基本不会增加额外的成本。
Method for metallizing surface of ceramic dielectric substrate, and ceramic dielectric substrate
一种在陶瓷介质基板表面金属化的方法及陶瓷介质基板
SU QIYI (author) / YAN YONG (author) / PAN JIADONG (author) / LIU JIANLIN (author) / XIE YIJING (author) / ZHUANG MENGQI (author)
2021-12-14
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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