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A platform for research: civil engineering, architecture and urbanism
Ceramic packaging shell and preparation method thereof
The invention relates to the field of electronic component shell production and packaging, in particular to a ceramic packaging shell and a preparation method thereof. The method comprises the steps that S1, a kovar alloy material and oxygen-free copper are welded together through explosive welding, and a low-stress composite material is formed; S2, the low-stress composite material is machined into a required size through a machining method to form a composite ring frame; and S3, a ceramic substrate is connected with the oxygen-free copper surface in the composite ring frame by adopting a brazing method to obtain the required ceramic packaging shell. The oxygen-free copper and kovar alloy are firstly connected in an explosive welding mode to form the low-stress composite material, then the low-stress composite material is brazed with the ceramic substrate, so that the cracking risk of the ceramic substrate is greatly reduced, and meanwhile, the oxygen-free copper improves the connection force between a traditional kovar alloy ring frame and the ceramic substrate, so that the prepared ceramic packaging shell is safer and more reliable.
本发明涉及电子元器件外壳生产封装领域，具体涉及一种陶瓷封装外壳及其制备方法。该方法步骤为：S1.将可伐合金材料与无氧铜通过爆炸焊焊接在一起，形成低应力复合材料；S2.通过机加工方法将低应力复合材料加工出需要的尺寸，形成复合环框；S3.采用钎焊方法将陶瓷基板和复合环框中无氧铜一面连接，即得到所需的陶瓷封装外壳。无氧铜和可伐合金首先采用爆炸焊方式连接，形成低应力复合材料，再与陶瓷基板钎焊，可以极大降低陶瓷基板碎裂风险，同时无氧铜提高了传统可伐合金环框与陶瓷基板间的连接力，使得制备的陶瓷封装外壳更加安全可靠。
Ceramic packaging shell and preparation method thereof
The invention relates to the field of electronic component shell production and packaging, in particular to a ceramic packaging shell and a preparation method thereof. The method comprises the steps that S1, a kovar alloy material and oxygen-free copper are welded together through explosive welding, and a low-stress composite material is formed; S2, the low-stress composite material is machined into a required size through a machining method to form a composite ring frame; and S3, a ceramic substrate is connected with the oxygen-free copper surface in the composite ring frame by adopting a brazing method to obtain the required ceramic packaging shell. The oxygen-free copper and kovar alloy are firstly connected in an explosive welding mode to form the low-stress composite material, then the low-stress composite material is brazed with the ceramic substrate, so that the cracking risk of the ceramic substrate is greatly reduced, and meanwhile, the oxygen-free copper improves the connection force between a traditional kovar alloy ring frame and the ceramic substrate, so that the prepared ceramic packaging shell is safer and more reliable.
本发明涉及电子元器件外壳生产封装领域，具体涉及一种陶瓷封装外壳及其制备方法。该方法步骤为：S1.将可伐合金材料与无氧铜通过爆炸焊焊接在一起，形成低应力复合材料；S2.通过机加工方法将低应力复合材料加工出需要的尺寸，形成复合环框；S3.采用钎焊方法将陶瓷基板和复合环框中无氧铜一面连接，即得到所需的陶瓷封装外壳。无氧铜和可伐合金首先采用爆炸焊方式连接，形成低应力复合材料，再与陶瓷基板钎焊，可以极大降低陶瓷基板碎裂风险，同时无氧铜提高了传统可伐合金环框与陶瓷基板间的连接力，使得制备的陶瓷封装外壳更加安全可靠。
Ceramic packaging shell and preparation method thereof
一种陶瓷封装外壳及其制备方法
ZHANG LILI (author) / WANG FENG (author) / YANG PENGFEI (author) / MENG XIANGLONG (author)
2022-01-18
Patent
Electronic Resource
Chinese
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