A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
The invention discloses a ceramic packaging base and a preparation method thereof, and relates to the technical field of electronic components. The invention provides a ceramic packaging base, which comprises a ceramic layer and a conductive layer, and the ceramic layer is adjacent to the conductive layer. The raw material of the ceramic layer comprises ceramic slurry, and the ceramic slurry comprises the following components: ceramic powder A, a photoinitiator A, a plasticizer A, a dispersant A and photosensitive resin A; the raw material of the conductive layer comprises conductive slurry, and the conductive slurry comprises the following components: metal powder, ceramic powder B, a photoinitiator B, a plasticizer B, a dispersing agent B and photosensitive resin B; in the conductive paste, the weight ratio of the ceramic powder B to the metal powder is (0.05-0.25): 1. The prepared ceramic packaging base is high in forming precision, and the problems of warping, cracking, machining deformation and the like cannot occur.
本发明公开了一种陶瓷封装基座及其制备方法，涉及电子元件技术领域。本发明提供了一种陶瓷封装基座，包括陶瓷层和导电层，所述陶瓷层和导电层相邻；所述陶瓷层的原料包括陶瓷浆料，所述陶瓷浆料包括以下组分：陶瓷粉体A、光引发剂A、增塑剂A、分散剂A、光敏树脂A；所述导电层的原料包括导电浆料，所述导电浆料包括以下组分：金属粉体、陶瓷粉体B、光引发剂B、增塑剂B、分散剂B、光敏树脂B；所述导电浆料中，陶瓷粉体B与金属粉体的重量比为(0.05‑0.25)：1。本发明制备的陶瓷封装基座，成型精度较高，且不会出现翘曲、开裂、加工变形等问题。
The invention discloses a ceramic packaging base and a preparation method thereof, and relates to the technical field of electronic components. The invention provides a ceramic packaging base, which comprises a ceramic layer and a conductive layer, and the ceramic layer is adjacent to the conductive layer. The raw material of the ceramic layer comprises ceramic slurry, and the ceramic slurry comprises the following components: ceramic powder A, a photoinitiator A, a plasticizer A, a dispersant A and photosensitive resin A; the raw material of the conductive layer comprises conductive slurry, and the conductive slurry comprises the following components: metal powder, ceramic powder B, a photoinitiator B, a plasticizer B, a dispersing agent B and photosensitive resin B; in the conductive paste, the weight ratio of the ceramic powder B to the metal powder is (0.05-0.25): 1. The prepared ceramic packaging base is high in forming precision, and the problems of warping, cracking, machining deformation and the like cannot occur.
本发明公开了一种陶瓷封装基座及其制备方法，涉及电子元件技术领域。本发明提供了一种陶瓷封装基座，包括陶瓷层和导电层，所述陶瓷层和导电层相邻；所述陶瓷层的原料包括陶瓷浆料，所述陶瓷浆料包括以下组分：陶瓷粉体A、光引发剂A、增塑剂A、分散剂A、光敏树脂A；所述导电层的原料包括导电浆料，所述导电浆料包括以下组分：金属粉体、陶瓷粉体B、光引发剂B、增塑剂B、分散剂B、光敏树脂B；所述导电浆料中，陶瓷粉体B与金属粉体的重量比为(0.05‑0.25)：1。本发明制备的陶瓷封装基座，成型精度较高，且不会出现翘曲、开裂、加工变形等问题。
Ceramic metal packaging shell, preparation method and application thereof
| European Patent Office | 2023