A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Thermal insulation integrated board production process and thermal insulation integrated board
The invention relates to a thermal insulation integrated plate production process which comprises the following steps: S1, cutting a back plate, S2, cutting a panel, S3, arranging plates and adjusting colors, S4, slotting, S5, splicing, taking the panel as a bottom plate, coating the panel with a viscous glue solution to form an adhesive layer, selecting a buckle, buckling the buckle into a clamping groove, then pasting a thermal insulation layer, coating the top surface of the thermal insulation layer with an adhesive layer again, and finally pasting the thermal insulation layer on the bottom plate. And then covering the back plate on the adhesive layer to finish assembly. S6, carrying out antifouling treatment on the assembled thermal insulation integrated plate; and S7, the treated heat preservation integrated plate is packaged, the face plate and the heat preservation layer are bonded through adhesives, the back plate and the heat preservation layer are bonded through adhesives, connection between the layers is firmer and more durable, falling and cracking are not likely to happen, the service life is long, and the manufacturing method is simple, environmentally friendly and low in cost.
本发明涉及一种保温一体板生产工艺，包括步骤如下：S1、背板切割，S2、面板切割，S3、排板调色，S4、开槽，S5、拼接，以面板为底板，在面板上涂上粘性胶液形成粘胶层，选取卡扣，并将卡扣扣入卡节槽内，随后贴上保温层，保温层的顶面再次涂抹一层粘胶层，随后将背板盖至粘胶层上，完成组装；S6、对组装完成后的保温一体板进行防污处理；S7、对处理后的保温一体板进行打包，通过采用粘胶剂将面板与保温层、背板与保温层之间的相互粘结，使层与层之间的连接更加牢固耐用，不易脱落破裂，寿命长，制作方法简单，环保，成本低。
Thermal insulation integrated board production process and thermal insulation integrated board
The invention relates to a thermal insulation integrated plate production process which comprises the following steps: S1, cutting a back plate, S2, cutting a panel, S3, arranging plates and adjusting colors, S4, slotting, S5, splicing, taking the panel as a bottom plate, coating the panel with a viscous glue solution to form an adhesive layer, selecting a buckle, buckling the buckle into a clamping groove, then pasting a thermal insulation layer, coating the top surface of the thermal insulation layer with an adhesive layer again, and finally pasting the thermal insulation layer on the bottom plate. And then covering the back plate on the adhesive layer to finish assembly. S6, carrying out antifouling treatment on the assembled thermal insulation integrated plate; and S7, the treated heat preservation integrated plate is packaged, the face plate and the heat preservation layer are bonded through adhesives, the back plate and the heat preservation layer are bonded through adhesives, connection between the layers is firmer and more durable, falling and cracking are not likely to happen, the service life is long, and the manufacturing method is simple, environmentally friendly and low in cost.
本发明涉及一种保温一体板生产工艺，包括步骤如下：S1、背板切割，S2、面板切割，S3、排板调色，S4、开槽，S5、拼接，以面板为底板，在面板上涂上粘性胶液形成粘胶层，选取卡扣，并将卡扣扣入卡节槽内，随后贴上保温层，保温层的顶面再次涂抹一层粘胶层，随后将背板盖至粘胶层上，完成组装；S6、对组装完成后的保温一体板进行防污处理；S7、对处理后的保温一体板进行打包，通过采用粘胶剂将面板与保温层、背板与保温层之间的相互粘结，使层与层之间的连接更加牢固耐用，不易脱落破裂，寿命长，制作方法简单，环保，成本低。
Thermal insulation integrated board production process and thermal insulation integrated board
一种保温一体板生产工艺及保温一体板
YANG HONGBO (author)
2022-04-01
Patent
Electronic Resource
Chinese
IPC:
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
| European Patent Office | 2023
| European Patent Office | 2022
Manufacturing method of thermal insulation integrated board
| European Patent Office | 2024
Photovoltaic thermal insulation integrated board for building
| European Patent Office | 2024
Combined honeycomb core thermal insulation integrated board
| European Patent Office | 2024