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Water-based inorganic siliceous microsphere thermal insulation material
The invention discloses a water-based inorganic siliceous microsphere thermal insulation material which comprises a component material A and a component material B, the fireproof thermal insulation board is low in heat conductivity coefficient, good in strength, low in water absorption rate, free of hollowing and cracking and easy to construct, solves the problems that organic thermal insulation materials such as expanded polystyrene foam thermal insulation boards/extruded polystyrene foam boards are poor in fireproof performance and strength, short in service life and complex in construction, and meanwhile keeps the advantage of being low in heat conductivity coefficient; the defects of poor heat conductivity coefficient, high water absorption rate, poor strength, easiness in cracking and complicated construction of inorganic thermal insulation materials such as rock wool boards/cement foaming boards/foam glass boards are overcome, and the advantage of A-level fire prevention is retained; the defects that inorganic thermal insulation mortar is poor in thermal insulation effect, poor in soaking strength and prone to hollowing and cracking are overcome. And meanwhile, as the inorganic material is adopted, the service life can reach the same as that of a building.
本发明公开了水性无机硅质微球保温材料，包括A组分材料与B组分材料。本发明导热系数低，强度好，吸水率低，不空鼓开裂，施工简单，解决了膨胀聚苯乙烯泡沫保温板/挤塑聚苯乙烯泡沫板等有机材质保温材料的防火性能差，强度差，寿命短，施工复杂的问题，同时保留了导热系数低的优点；解决了岩棉板/水泥发泡板/泡沫玻璃板等无机材质保温材料导热系数差，吸水率高，强度差，易开裂，施工复杂的缺点，保留了A级防火的优点；解决了无机保温砂浆保温效果差，浸水强度差，易空鼓开裂的缺点；同时，由于本发明为无机材质，使用年限可达到与建筑物同寿命。
Water-based inorganic siliceous microsphere thermal insulation material
The invention discloses a water-based inorganic siliceous microsphere thermal insulation material which comprises a component material A and a component material B, the fireproof thermal insulation board is low in heat conductivity coefficient, good in strength, low in water absorption rate, free of hollowing and cracking and easy to construct, solves the problems that organic thermal insulation materials such as expanded polystyrene foam thermal insulation boards/extruded polystyrene foam boards are poor in fireproof performance and strength, short in service life and complex in construction, and meanwhile keeps the advantage of being low in heat conductivity coefficient; the defects of poor heat conductivity coefficient, high water absorption rate, poor strength, easiness in cracking and complicated construction of inorganic thermal insulation materials such as rock wool boards/cement foaming boards/foam glass boards are overcome, and the advantage of A-level fire prevention is retained; the defects that inorganic thermal insulation mortar is poor in thermal insulation effect, poor in soaking strength and prone to hollowing and cracking are overcome. And meanwhile, as the inorganic material is adopted, the service life can reach the same as that of a building.
本发明公开了水性无机硅质微球保温材料，包括A组分材料与B组分材料。本发明导热系数低，强度好，吸水率低，不空鼓开裂，施工简单，解决了膨胀聚苯乙烯泡沫保温板/挤塑聚苯乙烯泡沫板等有机材质保温材料的防火性能差，强度差，寿命短，施工复杂的问题，同时保留了导热系数低的优点；解决了岩棉板/水泥发泡板/泡沫玻璃板等无机材质保温材料导热系数差，吸水率高，强度差，易开裂，施工复杂的缺点，保留了A级防火的优点；解决了无机保温砂浆保温效果差，浸水强度差，易空鼓开裂的缺点；同时，由于本发明为无机材质，使用年限可达到与建筑物同寿命。
Water-based inorganic siliceous microsphere thermal insulation material
水性无机硅质微球保温材料
LIAO YUANJU (author)
2022-04-29
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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