A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Ground structure for building and construction technology of ground structure
The invention discloses a floor structure for a building and a construction process thereof, and belongs to the technical field of building construction technologies, the floor structure specifically comprises an original structure floor, and further comprises a facing material, a concrete layer, a heat preservation layer, a bonding layer and an adhesion agent; the bonding layer, the heat preservation layer, the concrete layer and the facing material are sequentially laid on the original structure building floor coated with the adhesion agent. The bonding layer is used for bonding the heat preservation layer and the original structure floor, the used silica sol binder can repair fine cracks and cavities in the original structure floor, and further cracking of the structural floor is avoided; in addition, primary rough leveling can be carried out on the bonding layer before concrete is poured, meanwhile, the heat preservation layer can be effectively fixed, and then construction of a follow-up structural layer is simplified. Besides, the technical problems of ground cracking, dusting and the like in the prior art can be solved by only needing the thickest thickness of the ground structure provided by the invention to be 7cm, so that the indoor height is increased, and the living experience of residents is improved.
本发明公开了一种建筑楼用地面结构及其施工工艺，属于建筑施工技术技术领域，具体包括原结构楼地面，还包括：饰面材料、混凝土层、保温层、粘接层和界面剂；所述粘接层、保温层、混凝土层和饰面材料依次在涂刷有所述界面剂的原结构楼地面上铺设。本发明中使用了粘接层将保温层与原结构楼地面粘结，其中使用的硅溶胶粘结剂能够修复原结构楼地面上的细裂缝及空洞，进而避免结构楼板的进一步开裂；此外，粘接层能够在浇注混凝土前进行一次粗找平，同时能够有效的将保温层固定，进而简化后续结构层的施工。另外，本发明提供的地面结构最厚仅需7cm即可解决现有技术中地面开裂、起砂等技术问题，进而提升了室内的高度，提高了住户的居住体验。
Ground structure for building and construction technology of ground structure
The invention discloses a floor structure for a building and a construction process thereof, and belongs to the technical field of building construction technologies, the floor structure specifically comprises an original structure floor, and further comprises a facing material, a concrete layer, a heat preservation layer, a bonding layer and an adhesion agent; the bonding layer, the heat preservation layer, the concrete layer and the facing material are sequentially laid on the original structure building floor coated with the adhesion agent. The bonding layer is used for bonding the heat preservation layer and the original structure floor, the used silica sol binder can repair fine cracks and cavities in the original structure floor, and further cracking of the structural floor is avoided; in addition, primary rough leveling can be carried out on the bonding layer before concrete is poured, meanwhile, the heat preservation layer can be effectively fixed, and then construction of a follow-up structural layer is simplified. Besides, the technical problems of ground cracking, dusting and the like in the prior art can be solved by only needing the thickest thickness of the ground structure provided by the invention to be 7cm, so that the indoor height is increased, and the living experience of residents is improved.
本发明公开了一种建筑楼用地面结构及其施工工艺，属于建筑施工技术技术领域，具体包括原结构楼地面，还包括：饰面材料、混凝土层、保温层、粘接层和界面剂；所述粘接层、保温层、混凝土层和饰面材料依次在涂刷有所述界面剂的原结构楼地面上铺设。本发明中使用了粘接层将保温层与原结构楼地面粘结，其中使用的硅溶胶粘结剂能够修复原结构楼地面上的细裂缝及空洞，进而避免结构楼板的进一步开裂；此外，粘接层能够在浇注混凝土前进行一次粗找平，同时能够有效的将保温层固定，进而简化后续结构层的施工。另外，本发明提供的地面结构最厚仅需7cm即可解决现有技术中地面开裂、起砂等技术问题，进而提升了室内的高度，提高了住户的居住体验。
Ground structure for building and construction technology of ground structure
一种建筑楼用地面结构及其施工工艺
GUO YUPENG (author)
2022-05-13
Patent
Electronic Resource
Chinese
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
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