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Cutting and glue discharging process of chip type high-capacity multilayer ceramic capacitor
The invention relates to a cutting and glue discharging process for a chip-type high-capacity multilayer ceramic capacitor. The cutting and glue discharging process comprises the following steps: providing laminated chip-type high-capacity multilayer ceramic capacitor blocks and isolating sheets; forming a laminated structure by the block and the spacer; putting the laminated structure into a first baking oven; according to preset parameters, the temperature in the first baking box is adjusted, and first heat treatment is conducted on the laminated structure; obtaining the block after the first heat treatment, and cutting the block to obtain a chip green body; putting the chip green body into a second baking oven; and second heat treatment is carried out on the chip green body, and the temperature of the first heat treatment is lower than that of the second heat treatment. On the basis of an original cutting process, heat treatment is additionally carried out on the blocks before cutting, and the layering phenomenon of the cutting face generated when the blocks are cut is reduced; the qualified rate and the reliability of high-capacity products are improved; the process can be further applied to a vehicle gauge capacitor, and the requirement for high reliability is met.
本发明涉及一种片式高容多层陶瓷电容器的切割排胶工艺，包括以下步骤：提供层压后的片式高容多层陶瓷电容器巴块和隔离片；将巴块和隔离片形成叠层结构；将所述叠层结构放入第一烘烤箱中；按照预设的参数，调节所述第一烘烤箱内的温度，对所述叠层结构进行第一热处理；获取第一热处理后的所述巴块，并对其进行切割，得到芯片生坯；将芯片生坯放入第二烘烤箱中；对芯片生坯进行第二热处理，其中，第一热处理的温度低于所述第二热处理的温度。本发明在原有切割工艺基础上，在切割前增加对巴块进行热处理，减少了巴块切割时产生的切割面分层现象；提升高容产品的合格率和可靠性；该工艺可进一步应用在车规电容上，满足于高可靠性的要求。
Cutting and glue discharging process of chip type high-capacity multilayer ceramic capacitor
The invention relates to a cutting and glue discharging process for a chip-type high-capacity multilayer ceramic capacitor. The cutting and glue discharging process comprises the following steps: providing laminated chip-type high-capacity multilayer ceramic capacitor blocks and isolating sheets; forming a laminated structure by the block and the spacer; putting the laminated structure into a first baking oven; according to preset parameters, the temperature in the first baking box is adjusted, and first heat treatment is conducted on the laminated structure; obtaining the block after the first heat treatment, and cutting the block to obtain a chip green body; putting the chip green body into a second baking oven; and second heat treatment is carried out on the chip green body, and the temperature of the first heat treatment is lower than that of the second heat treatment. On the basis of an original cutting process, heat treatment is additionally carried out on the blocks before cutting, and the layering phenomenon of the cutting face generated when the blocks are cut is reduced; the qualified rate and the reliability of high-capacity products are improved; the process can be further applied to a vehicle gauge capacitor, and the requirement for high reliability is met.
本发明涉及一种片式高容多层陶瓷电容器的切割排胶工艺，包括以下步骤：提供层压后的片式高容多层陶瓷电容器巴块和隔离片；将巴块和隔离片形成叠层结构；将所述叠层结构放入第一烘烤箱中；按照预设的参数，调节所述第一烘烤箱内的温度，对所述叠层结构进行第一热处理；获取第一热处理后的所述巴块，并对其进行切割，得到芯片生坯；将芯片生坯放入第二烘烤箱中；对芯片生坯进行第二热处理，其中，第一热处理的温度低于所述第二热处理的温度。本发明在原有切割工艺基础上，在切割前增加对巴块进行热处理，减少了巴块切割时产生的切割面分层现象；提升高容产品的合格率和可靠性；该工艺可进一步应用在车规电容上，满足于高可靠性的要求。
Cutting and glue discharging process of chip type high-capacity multilayer ceramic capacitor
一种片式高容多层陶瓷电容器的切割排胶工艺
LEI YU (author) / CAI WEI (author) / LAN ZHENCHENG (author)
2023-01-06
Patent
Electronic Resource
Chinese
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