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Preparation method of ceramic diaphragm of chip-type high-capacity multilayer ceramic capacitor
The invention relates to a preparation method of a ceramic diaphragm of a chip-type high-capacity multilayer ceramic capacitor. The preparation method comprises the following steps: S1, preparing a high-polymerization-degree PVB (Polyvinyl Butyral) adhesive; s2, preparing a PVB adhesive with a low polymerization degree; s3, mixing the high-polymerization-degree PVB adhesive prepared in the step S1 and the low-polymerization-degree PVB adhesive prepared in the step S2 according to a ratio of (4-19): 1, and uniformly stirring to obtain a double-system PVB adhesive; s4, preparing primary ceramic slurry; s5, uniformly stirring and mixing the double-system PVB adhesive prepared in the step S3 and the primary ceramic slurry prepared in the step S4, and performing high-pressure dispersion, filtration and defoaming on the uniformly stirred slurry to obtain mixed ceramic slurry; and S6, coating a PET base film with the mixed ceramic slurry, and drying to obtain the ceramic diaphragm. Compared with the prior art, the ceramic diaphragm of the chip-type high-capacity multilayer ceramic capacitor prepared by the method has the advantages of high diaphragm hot pressing property and high diaphragm strength.
本发明涉及一种片式高容多层陶瓷电容器的陶瓷膜片的制备方法，包括以下步骤：S1：制备高聚合度PVB粘合剂；S2：制备低聚合度PVB粘合剂；S3：将步骤S1制得的高聚合度PVB粘合剂与步骤S2制得的低聚合度PVB粘合剂按照4‑19:1的比例混合并搅拌均匀，得到双体系PVB粘合剂；S4：制备初级瓷浆；S5：将步骤S3制备的双体系PVB粘合剂与步骤S4制备的初级瓷浆均匀搅拌混合，搅拌均匀的浆料经过高压分散、过滤和脱泡工序后得到混合瓷浆；S6：将混合瓷浆涂敷在PET基膜上，经干燥后得到陶瓷膜片。与现有技术相比，本发明的方法制备的片式高容多层陶瓷电容器的陶瓷膜片具有高的膜片热压着性和高膜片强度的优点。
Preparation method of ceramic diaphragm of chip-type high-capacity multilayer ceramic capacitor
The invention relates to a preparation method of a ceramic diaphragm of a chip-type high-capacity multilayer ceramic capacitor. The preparation method comprises the following steps: S1, preparing a high-polymerization-degree PVB (Polyvinyl Butyral) adhesive; s2, preparing a PVB adhesive with a low polymerization degree; s3, mixing the high-polymerization-degree PVB adhesive prepared in the step S1 and the low-polymerization-degree PVB adhesive prepared in the step S2 according to a ratio of (4-19): 1, and uniformly stirring to obtain a double-system PVB adhesive; s4, preparing primary ceramic slurry; s5, uniformly stirring and mixing the double-system PVB adhesive prepared in the step S3 and the primary ceramic slurry prepared in the step S4, and performing high-pressure dispersion, filtration and defoaming on the uniformly stirred slurry to obtain mixed ceramic slurry; and S6, coating a PET base film with the mixed ceramic slurry, and drying to obtain the ceramic diaphragm. Compared with the prior art, the ceramic diaphragm of the chip-type high-capacity multilayer ceramic capacitor prepared by the method has the advantages of high diaphragm hot pressing property and high diaphragm strength.
本发明涉及一种片式高容多层陶瓷电容器的陶瓷膜片的制备方法，包括以下步骤：S1：制备高聚合度PVB粘合剂；S2：制备低聚合度PVB粘合剂；S3：将步骤S1制得的高聚合度PVB粘合剂与步骤S2制得的低聚合度PVB粘合剂按照4‑19:1的比例混合并搅拌均匀，得到双体系PVB粘合剂；S4：制备初级瓷浆；S5：将步骤S3制备的双体系PVB粘合剂与步骤S4制备的初级瓷浆均匀搅拌混合，搅拌均匀的浆料经过高压分散、过滤和脱泡工序后得到混合瓷浆；S6：将混合瓷浆涂敷在PET基膜上，经干燥后得到陶瓷膜片。与现有技术相比，本发明的方法制备的片式高容多层陶瓷电容器的陶瓷膜片具有高的膜片热压着性和高膜片强度的优点。
Preparation method of ceramic diaphragm of chip-type high-capacity multilayer ceramic capacitor
一种片式高容多层陶瓷电容器的陶瓷膜片的制备方法
WANG AO (author) / ZHOU XIAOJUN (author) / ZHANG XUMEI (author)
2023-02-03
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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