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Glass powder and application of copper paste containing glass powder on ZnO voltage-sensitive ceramic substrate
The invention provides glass powder and application of copper paste containing the glass powder on a ZnO voltage-sensitive ceramic matrix, the glass powder comprises the main components of Bi-Mn-B-Si-Li-Cu and other special trace elements, the transition temperature of the glass powder is 300-400 DEG C, the thermal expansion coefficient is 6.5-8.5 * 10 <-6 >/DEG C, the average particle size of the glass powder is controlled to be 2-4 microns, and the thickness of the glass powder is 10-20 microns. When the glass powder is used in conductive copper paste, a wide sintering window of 550-850 DEG C can be met, firm physical and chemical bonding with a ceramic matrix is achieved, and the adhesive force of a copper layer is improved. According to the preparation method of the glass powder, the particle size range of the glass powder can be accurately controlled, and the glass powder has excellent dispersity in slurry. Meanwhile, special trace elements are added into the glass powder to improve the oxidation resistance of the copper paste in the sintering process, and the copper paste prepared from the glass powder has higher electrical properties and shows excellent adhesive force and ageing resistance when being applied to a ceramic matrix.
本发明提供了一种玻璃粉以及含该玻璃粉铜浆在ZnO压敏陶瓷基体上的应用，玻璃粉的主要组分为Bi‑Mn‑B‑Si‑Li‑Cu以及其他特殊微量元素，其中，玻璃粉的转变温度在300～400℃，热膨胀系数在6.5～8.5×10‑6/℃，玻璃粉的平均粒径控制在2～4微米，将该玻璃粉用于导电铜浆中可以满足550℃‑850℃较宽的烧结窗口，且与陶瓷基体具有牢固的物理化学键合，提升铜层的附着力。该玻璃粉制备能较精确的控制玻璃粉的粒径范围，保证在浆料中具有优异的分散性。同时在该玻璃粉中添加特殊微量元素改善铜浆烧结过程中抗氧化性，用该玻璃粉制备的铜浆应用于陶瓷基体上均有较高的电学性能，展现优异的附着力和抗老化能力。
Glass powder and application of copper paste containing glass powder on ZnO voltage-sensitive ceramic substrate
The invention provides glass powder and application of copper paste containing the glass powder on a ZnO voltage-sensitive ceramic matrix, the glass powder comprises the main components of Bi-Mn-B-Si-Li-Cu and other special trace elements, the transition temperature of the glass powder is 300-400 DEG C, the thermal expansion coefficient is 6.5-8.5 * 10 <-6 >/DEG C, the average particle size of the glass powder is controlled to be 2-4 microns, and the thickness of the glass powder is 10-20 microns. When the glass powder is used in conductive copper paste, a wide sintering window of 550-850 DEG C can be met, firm physical and chemical bonding with a ceramic matrix is achieved, and the adhesive force of a copper layer is improved. According to the preparation method of the glass powder, the particle size range of the glass powder can be accurately controlled, and the glass powder has excellent dispersity in slurry. Meanwhile, special trace elements are added into the glass powder to improve the oxidation resistance of the copper paste in the sintering process, and the copper paste prepared from the glass powder has higher electrical properties and shows excellent adhesive force and ageing resistance when being applied to a ceramic matrix.
本发明提供了一种玻璃粉以及含该玻璃粉铜浆在ZnO压敏陶瓷基体上的应用，玻璃粉的主要组分为Bi‑Mn‑B‑Si‑Li‑Cu以及其他特殊微量元素，其中，玻璃粉的转变温度在300～400℃，热膨胀系数在6.5～8.5×10‑6/℃，玻璃粉的平均粒径控制在2～4微米，将该玻璃粉用于导电铜浆中可以满足550℃‑850℃较宽的烧结窗口，且与陶瓷基体具有牢固的物理化学键合，提升铜层的附着力。该玻璃粉制备能较精确的控制玻璃粉的粒径范围，保证在浆料中具有优异的分散性。同时在该玻璃粉中添加特殊微量元素改善铜浆烧结过程中抗氧化性，用该玻璃粉制备的铜浆应用于陶瓷基体上均有较高的电学性能，展现优异的附着力和抗老化能力。
Glass powder and application of copper paste containing glass powder on ZnO voltage-sensitive ceramic substrate
一种玻璃粉以及含该玻璃粉铜浆在ZnO压敏陶瓷基体上的应用
LI YAN (author) / CHEN JIANGJUN (author) / GAO JUN (author)
2023-01-17
Patent
Electronic Resource
Chinese
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