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A platform for research: civil engineering, architecture and urbanism
Glass powder for conductive gold paste as well as preparation method and application of glass powder
The invention discloses glass powder for conductive gold paste as well as a preparation method and application thereof. The basic component of the glass is a compound system of P2O5-SiO2-B2O3-Al2O3 and Bi2O3-SiO2-B2O3-Al2O3, and Na2O, CaO, CuO, Sb2O3, ZrO2, NaF and the like are respectively added into the basic glass component, so that the single glass system and the compound glass powder have lower glass transition temperature and excellent high-temperature fluidity, and have excellent wetting and sintering-assisting effects on the gold powder. The average particle size of the glass powder is 2-3 microns, and the thermal expansion coefficient of the glass is 6.0-8.5 ppm/DEG C. When the glass powder is used in the conductive gold paste, the conductive gold paste can have firm physical and chemical bonding with an aluminum oxide ceramic substrate and an aluminum nitride ceramic substrate, and after being sintered on the substrate, the conductive gold paste has relatively high electrical properties (4.5-15.3 m omega), excellent adhesive force (10-25N) and good chemical stability (weight loss is lower than 0.5%).
本发明公开一种导电金浆用玻璃粉、制备方法及其应用。玻璃基础组分为P2O5‑SiO2‑B2O3‑Al2O3与Bi2O3‑SiO2‑B2O3‑Al2O3复配体系，在分别在基础玻璃组分中添Na2O、CaO、CuO、Sb2O3、ZrO2、NaF等使单玻璃体系与复合玻璃粉具备较低的玻璃转变温度，优良的高温流动性，对金粉具有优异的润湿与助烧效果。玻璃粉的平均粒径在2‑3微米之间，玻璃的热膨胀系数为6.0～8.5ppm/℃。将该玻璃粉用于导电金浆中可以使导电金浆与氧化铝、氮化铝陶瓷基板具有牢固的物理化学键合，在基板上烧结后均有较高的电学性能(4.5～15.3mΩ)，展现优异的附着力(10～25N)和良好的化学稳定性(失重低于0.5％)。
Glass powder for conductive gold paste as well as preparation method and application of glass powder
The invention discloses glass powder for conductive gold paste as well as a preparation method and application thereof. The basic component of the glass is a compound system of P2O5-SiO2-B2O3-Al2O3 and Bi2O3-SiO2-B2O3-Al2O3, and Na2O, CaO, CuO, Sb2O3, ZrO2, NaF and the like are respectively added into the basic glass component, so that the single glass system and the compound glass powder have lower glass transition temperature and excellent high-temperature fluidity, and have excellent wetting and sintering-assisting effects on the gold powder. The average particle size of the glass powder is 2-3 microns, and the thermal expansion coefficient of the glass is 6.0-8.5 ppm/DEG C. When the glass powder is used in the conductive gold paste, the conductive gold paste can have firm physical and chemical bonding with an aluminum oxide ceramic substrate and an aluminum nitride ceramic substrate, and after being sintered on the substrate, the conductive gold paste has relatively high electrical properties (4.5-15.3 m omega), excellent adhesive force (10-25N) and good chemical stability (weight loss is lower than 0.5%).
本发明公开一种导电金浆用玻璃粉、制备方法及其应用。玻璃基础组分为P2O5‑SiO2‑B2O3‑Al2O3与Bi2O3‑SiO2‑B2O3‑Al2O3复配体系，在分别在基础玻璃组分中添Na2O、CaO、CuO、Sb2O3、ZrO2、NaF等使单玻璃体系与复合玻璃粉具备较低的玻璃转变温度，优良的高温流动性，对金粉具有优异的润湿与助烧效果。玻璃粉的平均粒径在2‑3微米之间，玻璃的热膨胀系数为6.0～8.5ppm/℃。将该玻璃粉用于导电金浆中可以使导电金浆与氧化铝、氮化铝陶瓷基板具有牢固的物理化学键合，在基板上烧结后均有较高的电学性能(4.5～15.3mΩ)，展现优异的附着力(10～25N)和良好的化学稳定性(失重低于0.5％)。
Glass powder for conductive gold paste as well as preparation method and application of glass powder
一种导电金浆用玻璃粉、制备方法及其应用
CHEN CHUNYU (author) / ZENG HUIDAN (author) / ZHANG SHENRUI (author)
2024-12-17
Patent
Electronic Resource
Chinese
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