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Ceramic, probe guide member, probe card, and socket for package inspection
The invention relates to a ceramic, a probe guide member, a probe card, and a socket for package inspection. The ceramic according to the present invention is composed of, in mass%, 20.0 to 55.0% of BN, 5.0 to 40.0% of SiC, 3.0 to 34.8% of ZrO2, or 3.0 to 38.7% of ZrO2 and Si3N4. The ceramic has a coefficient of thermal expansion of 1.0 * 10 <-6 >-5.0 * 10 <-6 >/DEG C at-50 to 500 DEG C, has low charge (106-1014 [Omega] * cm in terms of volume resistivity) and excellent machinability, and thus is suitable for use in, for example, a probe guide member for guiding a probe of a probe card, a socket for package inspection, and the like.
本发明涉及陶瓷、探针引导构件、探针卡及封装检查用插座。本发明的陶瓷以质量％计，由BN：20.0～55.0％、SiC：5.0～40.0％、ZrO2：3.0～34.8％、或ZrO2和Si3N4：3.0～38.7％构成。该陶瓷在‑50～500℃下的热膨胀系数为1.0×10‑6～5.0×10‑6/℃，低带电性(以体积电阻率计为106～1014Ω·cm)和易切削性优异，因此适合使用在例如用于对探针卡的探针进行引导的探针引导构件、封装检查用插座等。
Ceramic, probe guide member, probe card, and socket for package inspection
The invention relates to a ceramic, a probe guide member, a probe card, and a socket for package inspection. The ceramic according to the present invention is composed of, in mass%, 20.0 to 55.0% of BN, 5.0 to 40.0% of SiC, 3.0 to 34.8% of ZrO2, or 3.0 to 38.7% of ZrO2 and Si3N4. The ceramic has a coefficient of thermal expansion of 1.0 * 10 <-6 >-5.0 * 10 <-6 >/DEG C at-50 to 500 DEG C, has low charge (106-1014 [Omega] * cm in terms of volume resistivity) and excellent machinability, and thus is suitable for use in, for example, a probe guide member for guiding a probe of a probe card, a socket for package inspection, and the like.
本发明涉及陶瓷、探针引导构件、探针卡及封装检查用插座。本发明的陶瓷以质量％计，由BN：20.0～55.0％、SiC：5.0～40.0％、ZrO2：3.0～34.8％、或ZrO2和Si3N4：3.0～38.7％构成。该陶瓷在‑50～500℃下的热膨胀系数为1.0×10‑6～5.0×10‑6/℃，低带电性(以体积电阻率计为106～1014Ω·cm)和易切削性优异，因此适合使用在例如用于对探针卡的探针进行引导的探针引导构件、封装检查用插座等。
Ceramic, probe guide member, probe card, and socket for package inspection
陶瓷、探针引导构件、探针卡及封装检查用插座
YAMAGISHI WATARU (author) / MORI KAZUMASA (author) / ETO SHUNICHI (author)
2023-01-20
Patent
Electronic Resource
Chinese
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