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Repair method of ceramic part for wafer processing
The invention discloses a method for repairing a ceramic part for wafer processing. The method comprises the following steps: repairing defects on the surface of the ceramic part for wafer processing; repairing defects on the edge of the ceramic piece for wafer processing; repairing the defect on the through hole of the ceramic piece for wafer processing; abrasion on the surface of the ceramic part for wafer processing is repaired; and the repaired ceramic piece for wafer processing is detected. According to the repairing method, the abrasion on the surface of the ceramic part for wafer machining is repaired, the defects on the surface, the edge and the through hole of the ceramic part are also repaired, the defects caused on the surface, the edge and the through hole of the ceramic part in the wafer machining process are repaired, the repaired ceramic part can be used for wafer machining again, and the wafer machining efficiency is improved. And the wafer processing cost is reduced.
本发明公开了一种晶圆加工用陶瓷件的修复方法，包括：对晶圆加工用陶瓷件的表面上的缺损进行修复；对晶圆加工用陶瓷件的边缘上的缺损进行修复；对晶圆加工用陶瓷件的通孔上的缺损进行修复；对晶圆加工用陶瓷件的表面上的磨损进行修复；对修复后的晶圆加工用陶瓷件进行检测。该修复方法不仅对晶圆加工用陶瓷件的表面上的磨损进行修复，还对其表面、边缘和通孔上的缺损进行修复，通过对晶圆加工过程中在陶瓷件表面、边缘和通孔造成的缺损进行修复，修复后的陶瓷件能够再次用于晶圆加工，降低晶圆加工的成本。
Repair method of ceramic part for wafer processing
The invention discloses a method for repairing a ceramic part for wafer processing. The method comprises the following steps: repairing defects on the surface of the ceramic part for wafer processing; repairing defects on the edge of the ceramic piece for wafer processing; repairing the defect on the through hole of the ceramic piece for wafer processing; abrasion on the surface of the ceramic part for wafer processing is repaired; and the repaired ceramic piece for wafer processing is detected. According to the repairing method, the abrasion on the surface of the ceramic part for wafer machining is repaired, the defects on the surface, the edge and the through hole of the ceramic part are also repaired, the defects caused on the surface, the edge and the through hole of the ceramic part in the wafer machining process are repaired, the repaired ceramic part can be used for wafer machining again, and the wafer machining efficiency is improved. And the wafer processing cost is reduced.
本发明公开了一种晶圆加工用陶瓷件的修复方法，包括：对晶圆加工用陶瓷件的表面上的缺损进行修复；对晶圆加工用陶瓷件的边缘上的缺损进行修复；对晶圆加工用陶瓷件的通孔上的缺损进行修复；对晶圆加工用陶瓷件的表面上的磨损进行修复；对修复后的晶圆加工用陶瓷件进行检测。该修复方法不仅对晶圆加工用陶瓷件的表面上的磨损进行修复，还对其表面、边缘和通孔上的缺损进行修复，通过对晶圆加工过程中在陶瓷件表面、边缘和通孔造成的缺损进行修复，修复后的陶瓷件能够再次用于晶圆加工，降低晶圆加工的成本。
Repair method of ceramic part for wafer processing
一种晶圆加工用陶瓷件的修复方法
ZHAO YUANYA (author) / CUI SIYUAN (author) / WEN GUOSHENG (author) / JIN CONGLONG (author)
2023-03-31
Patent
Electronic Resource
Chinese
IPC:
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
B24B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
,
Maschinen, Einrichtungen oder Verfahren zum Schleifen oder Polieren
/
C04B
Kalk
,
LIME
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