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Ceramic structure and wafer system
A heater includes a base body, resistance heating element, and terminal part. The base body comprises ceramic, is plate shaped, and includes a hole on its lower surface. The resistance heating element is inside the base body. The terminal part is electrically connected to an internal conductor, is at least partially located inside the base body, and is exposed from a lower surface of the base body to an exterior of the base body. The terminal part includes a connection conductor that is inserted in the hole and connected to the internal conductor. A lower surface of the connection conductor is located on a side closer to the upper surface of the base body. The hole includes a reduced-diameter portion which has a diameter smaller than a diameter of the connection conductor between the lower surface of the connection conductor and the lower surface of the base body.
Ceramic structure and wafer system
A heater includes a base body, resistance heating element, and terminal part. The base body comprises ceramic, is plate shaped, and includes a hole on its lower surface. The resistance heating element is inside the base body. The terminal part is electrically connected to an internal conductor, is at least partially located inside the base body, and is exposed from a lower surface of the base body to an exterior of the base body. The terminal part includes a connection conductor that is inserted in the hole and connected to the internal conductor. A lower surface of the connection conductor is located on a side closer to the upper surface of the base body. The hole includes a reduced-diameter portion which has a diameter smaller than a diameter of the connection conductor between the lower surface of the connection conductor and the lower surface of the base body.
Ceramic structure and wafer system
KAWANABE YASUNORI (author) / OKAWA YOSHIHIRO (author)
2024-11-12
Patent
Electronic Resource
English
Ceramic wafer for improving conductivity of pure water and manufacturing device of ceramic wafer
| European Patent Office | 2022