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The invention relates to the field of foundation treatment, in particular to a foundation treatment process which comprises the following steps: S1, drilling or impacting a hole in a foundation to obtain an initial pile hole; s2, the initial pile hole is filled with filler; s3, the filler is tamped downwards; s4, the step S2 and the step S3 are repeated until the initial pile hole is tamped and filled to the preset height, and dense piles and compacted soil between the piles are formed in the filling part; s5, drilling is conducted on the dense pile, a secondary pile hole is obtained, and the hole diameter of the secondary pile hole is smaller than that of the initial pile hole; and S6, piling is conducted in the secondary pile hole. The pile foundation has the effects of reducing settlement deformation of the foundation and improving the bearing capacity of the pile foundation.
本申请涉及一种地基处理工艺,涉及地基处理的领域,其包括如下步骤:S1:在地基上钻孔或冲击成孔,得初始桩孔;S2:向初始桩孔内填充填料;S3:将填料向下夯实;S4:重复S2和S3,直至将初始桩孔夯填至预设高度,填料部分形成密实桩和挤密后的桩间土;S5:在密实桩上钻孔,得二次桩孔,二次桩孔的孔径小于初始桩孔的孔径;S6:在二次桩孔内打桩。本申请具有降低地基沉降变形和提高桩基承载力的效果。
The invention relates to the field of foundation treatment, in particular to a foundation treatment process which comprises the following steps: S1, drilling or impacting a hole in a foundation to obtain an initial pile hole; s2, the initial pile hole is filled with filler; s3, the filler is tamped downwards; s4, the step S2 and the step S3 are repeated until the initial pile hole is tamped and filled to the preset height, and dense piles and compacted soil between the piles are formed in the filling part; s5, drilling is conducted on the dense pile, a secondary pile hole is obtained, and the hole diameter of the secondary pile hole is smaller than that of the initial pile hole; and S6, piling is conducted in the secondary pile hole. The pile foundation has the effects of reducing settlement deformation of the foundation and improving the bearing capacity of the pile foundation.
本申请涉及一种地基处理工艺,涉及地基处理的领域,其包括如下步骤:S1:在地基上钻孔或冲击成孔,得初始桩孔;S2:向初始桩孔内填充填料;S3:将填料向下夯实;S4:重复S2和S3,直至将初始桩孔夯填至预设高度,填料部分形成密实桩和挤密后的桩间土;S5:在密实桩上钻孔,得二次桩孔,二次桩孔的孔径小于初始桩孔的孔径;S6:在二次桩孔内打桩。本申请具有降低地基沉降变形和提高桩基承载力的效果。
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