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A platform for research: civil engineering, architecture and urbanism
Ceramic substrate preparation method and ceramic substrate
The invention provides a ceramic substrate preparation method and a ceramic substrate, and relates to the technical field of semiconductor test materials. The preparation method of the ceramic substrate comprises the following steps: preparing ceramic tape casting slurry and preparing a green tape; cutting the green tape, and sintering the green tape into mature ceramic chips; punching the cooked ceramic chip, filling the cooked ceramic chip with the through hole slurry, and then carrying out heat preservation; printing conductor paste on the surface of the cooked ceramic chip, and performing heat preservation after manufacturing a circuit layer; printing glass paste on the surface of the cooked ceramic chip, and then performing lamination, sintering and heat preservation; and performing post-treatment on the cooked ceramic chip to prepare the ceramic substrate, thereby realizing a ceramic substrate scheme which has the advantages of high mechanical strength, high heat conductivity, convenience in post-processing treatment and the like.
本申请提供一种陶瓷基板制备方法及陶瓷基板，涉及半导体测试材料技术领域。所述陶瓷基板制备方法，包括：配置陶瓷流延浆料并制备生瓷带；对生瓷带进行切割后烧结成熟瓷片；对熟瓷片进行打孔，并填满通孔浆料后进行保温；在熟瓷片表面印刷导体浆料，制作线路层后进行保温；在熟瓷片表面印刷玻璃膏后进行叠层、烧结和保温；对熟瓷片进行后处理，制成陶瓷基板，实现了具有机械强度高、热导率高、便于后加工处理等众多优势的陶瓷基板方案。
Ceramic substrate preparation method and ceramic substrate
The invention provides a ceramic substrate preparation method and a ceramic substrate, and relates to the technical field of semiconductor test materials. The preparation method of the ceramic substrate comprises the following steps: preparing ceramic tape casting slurry and preparing a green tape; cutting the green tape, and sintering the green tape into mature ceramic chips; punching the cooked ceramic chip, filling the cooked ceramic chip with the through hole slurry, and then carrying out heat preservation; printing conductor paste on the surface of the cooked ceramic chip, and performing heat preservation after manufacturing a circuit layer; printing glass paste on the surface of the cooked ceramic chip, and then performing lamination, sintering and heat preservation; and performing post-treatment on the cooked ceramic chip to prepare the ceramic substrate, thereby realizing a ceramic substrate scheme which has the advantages of high mechanical strength, high heat conductivity, convenience in post-processing treatment and the like.
本申请提供一种陶瓷基板制备方法及陶瓷基板，涉及半导体测试材料技术领域。所述陶瓷基板制备方法，包括：配置陶瓷流延浆料并制备生瓷带；对生瓷带进行切割后烧结成熟瓷片；对熟瓷片进行打孔，并填满通孔浆料后进行保温；在熟瓷片表面印刷导体浆料，制作线路层后进行保温；在熟瓷片表面印刷玻璃膏后进行叠层、烧结和保温；对熟瓷片进行后处理，制成陶瓷基板，实现了具有机械强度高、热导率高、便于后加工处理等众多优势的陶瓷基板方案。
Ceramic substrate preparation method and ceramic substrate
一种陶瓷基板制备方法及陶瓷基板
YU JIAYAN (author) / CHEN CHEN (author) / LUO XIONGKE (author)
2023-05-26
Patent
Electronic Resource
Chinese
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