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Sintering formula and sintering process of high-thermal-conductivity silicon nitride substrate
The invention discloses a high-thermal-conductivity silicon nitride substrate sintering formula and a sintering process, and belongs to the technical field of new materials.Silicon nitride powder and a sintering aid are scientifically proportioned, and technological parameters are optimized, so that the thermal conductivity of a silicon nitride substrate is greatly improved and can reach 170W. M <-1 >. K <-1 > or above, and the thermal conductivity of the silicon nitride substrate can reach 170W. M <-1 >. K <-1 > or above. And meanwhile, good mechanical performance is ensured.
本发明公开了一种高导热氮化硅基板烧结配方和烧结工艺，属于新材料技术领域，本申请通过对氮化硅粉体和助烧剂进行科学配比，并在工艺参数上进行优化处理，从而大大改善了氮化硅基板的热导率，能够达到170W·m‑1·K‑1以上，同时保证了良好的机械性能。
Sintering formula and sintering process of high-thermal-conductivity silicon nitride substrate
The invention discloses a high-thermal-conductivity silicon nitride substrate sintering formula and a sintering process, and belongs to the technical field of new materials.Silicon nitride powder and a sintering aid are scientifically proportioned, and technological parameters are optimized, so that the thermal conductivity of a silicon nitride substrate is greatly improved and can reach 170W. M <-1 >. K <-1 > or above, and the thermal conductivity of the silicon nitride substrate can reach 170W. M <-1 >. K <-1 > or above. And meanwhile, good mechanical performance is ensured.
本发明公开了一种高导热氮化硅基板烧结配方和烧结工艺，属于新材料技术领域，本申请通过对氮化硅粉体和助烧剂进行科学配比，并在工艺参数上进行优化处理，从而大大改善了氮化硅基板的热导率，能够达到170W·m‑1·K‑1以上，同时保证了良好的机械性能。
Sintering formula and sintering process of high-thermal-conductivity silicon nitride substrate
一种高导热氮化硅基板烧结配方和烧结工艺
LIN DELONG (author)
2023-09-05
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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