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Implementation method for cement-free laying of graphene floor heating tiles
The invention discloses an implementation method for cement-free laying of graphene floor heating tiles, comprising a tile A, a tile B and an implementation method, tile glue is connected below the tile A and the tile B, a T-shaped strip is mounted between the tile A and the tile B, an aluminum alloy layer is connected to the bottom of the tile glue, a PET layer is connected below the aluminum alloy layer, and a heating layer is connected to one side of the PET layer. The bottom of the heating layer is provided with a thermal insulation layer, and the aluminum alloy layer comprises an aluminum alloy surface A, an aluminum alloy surface B and an aluminum film conductive adhesive tape. In the invention, an aluminum-plastic composite film is laid above the graphene heating film, the aluminum alloy surface faces upwards, the aluminum alloy surface is connected with a conductive integral surface by using the conductive adhesive tape, and the aluminum alloy surface is brushed with tile glue and laid with tiles; the aluminum alloy surface layer is connected to the ground to achieve overall grounding, shielding and safety guarantee of floor heating, the T-shaped reinforcing structures are additionally arranged at the adjacent joints of the ceramic tiles, the integrity of the ceramic tiles is enhanced, and therefore the problems and defects of an existing device are effectively solved.
本发明公开了石墨烯地暖瓷砖无水泥铺设的实现方法,包括瓷砖A,瓷砖B和实现方法,瓷砖A和瓷砖B的下方连接有瓷砖胶,瓷砖A和瓷砖B之间安装有T形条,瓷砖胶的底部连接有铝合金层,铝合金层的下方连接有PET层,PET层的一侧连接有发热层,发热层的底部设置有保温层,铝合金层包括铝合金面A,铝合金面B和铝膜导电胶带,本发明中,在石墨烯发热膜的上方铺设铝塑复合膜,铝合金面向上、用导电胶带将铝合金面连城导电整体面,在铝合金面上刷瓷砖胶、铺设瓷砖,将铝合金面层接入大地实现地暖整体接地、屏蔽、安全保障,在瓷砖相邻接缝处增加T形加强结构,增强瓷砖一体性从而有效的解决了现有装置出现的问题和不足。
Implementation method for cement-free laying of graphene floor heating tiles
The invention discloses an implementation method for cement-free laying of graphene floor heating tiles, comprising a tile A, a tile B and an implementation method, tile glue is connected below the tile A and the tile B, a T-shaped strip is mounted between the tile A and the tile B, an aluminum alloy layer is connected to the bottom of the tile glue, a PET layer is connected below the aluminum alloy layer, and a heating layer is connected to one side of the PET layer. The bottom of the heating layer is provided with a thermal insulation layer, and the aluminum alloy layer comprises an aluminum alloy surface A, an aluminum alloy surface B and an aluminum film conductive adhesive tape. In the invention, an aluminum-plastic composite film is laid above the graphene heating film, the aluminum alloy surface faces upwards, the aluminum alloy surface is connected with a conductive integral surface by using the conductive adhesive tape, and the aluminum alloy surface is brushed with tile glue and laid with tiles; the aluminum alloy surface layer is connected to the ground to achieve overall grounding, shielding and safety guarantee of floor heating, the T-shaped reinforcing structures are additionally arranged at the adjacent joints of the ceramic tiles, the integrity of the ceramic tiles is enhanced, and therefore the problems and defects of an existing device are effectively solved.
本发明公开了石墨烯地暖瓷砖无水泥铺设的实现方法,包括瓷砖A,瓷砖B和实现方法,瓷砖A和瓷砖B的下方连接有瓷砖胶,瓷砖A和瓷砖B之间安装有T形条,瓷砖胶的底部连接有铝合金层,铝合金层的下方连接有PET层,PET层的一侧连接有发热层,发热层的底部设置有保温层,铝合金层包括铝合金面A,铝合金面B和铝膜导电胶带,本发明中,在石墨烯发热膜的上方铺设铝塑复合膜,铝合金面向上、用导电胶带将铝合金面连城导电整体面,在铝合金面上刷瓷砖胶、铺设瓷砖,将铝合金面层接入大地实现地暖整体接地、屏蔽、安全保障,在瓷砖相邻接缝处增加T形加强结构,增强瓷砖一体性从而有效的解决了现有装置出现的问题和不足。
Implementation method for cement-free laying of graphene floor heating tiles
石墨烯地暖瓷砖无水泥铺设的实现方法
REN LIANGLIANG (author) / HUANG MIN (author)
2023-12-01
Patent
Electronic Resource
Chinese
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