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Microwave composite dielectric substrate and preparation method thereof
The invention provides a microwave composite dielectric substrate and a preparation method thereof, and the method comprises the steps: uniformly mixing ammonia water, deionized water, ethanol and cetyltrimethylammonium bromide, adding tetraethyl orthosilicate into the mixed solution, carrying out a stirring reaction, and after the reaction is finished, carrying out centrifugation and drying to obtain a solid product; carrying out high-temperature calcination treatment on the solid product to obtain micron-sized micro-mesoporous silicon dioxide spheres; mixing the micron-sized micro-mesoporous silicon dioxide spheres with a polytetrafluoroethylene emulsion to obtain an organic-inorganic blend; calendaring and molding the organic-inorganic blend by adopting a calendaring and mixing process to obtain a composite material pre-pressed sheet; and carrying out vacuum hot pressing sintering treatment on the composite material pre-pressed sheet to obtain the microwave composite dielectric substrate. Micro-mesoporous silicon dioxide spheres are formed and form pinning physical interaction with a polytetrafluoroethylene molecular chain, so that the composite material has relatively low dielectric constant, dielectric loss and thermal expansion coefficient.
本发明提出了一种微波复合介质基板及其制备方法，包括：将氨水、去离子水、乙醇以及十六烷基三甲基溴化铵混合均匀，将正硅酸四乙酯加入上述混合溶液中，搅拌反应，反应结束后，经离心、烘干得到固体产物；将上述固体产物经高温煅烧处理，得到微米级的微‑介孔二氧化硅球；将上述微米级的微‑介孔二氧化硅球与聚四氟乙烯乳液混合，得到有机‑无机共混物；将上述有机‑无机共混物采用压延混炼工艺压延成型，得到复合材料预压片；将上述复合材料预压片经真空热压烧结处理，得到微波复合介质基板。通过形成微‑介孔二氧化硅球，与聚四氟乙烯分子链形成“钉扎”物理相互作用，促使复合材料兼具较低的介电常数、介电损耗及热膨胀系数。
Microwave composite dielectric substrate and preparation method thereof
The invention provides a microwave composite dielectric substrate and a preparation method thereof, and the method comprises the steps: uniformly mixing ammonia water, deionized water, ethanol and cetyltrimethylammonium bromide, adding tetraethyl orthosilicate into the mixed solution, carrying out a stirring reaction, and after the reaction is finished, carrying out centrifugation and drying to obtain a solid product; carrying out high-temperature calcination treatment on the solid product to obtain micron-sized micro-mesoporous silicon dioxide spheres; mixing the micron-sized micro-mesoporous silicon dioxide spheres with a polytetrafluoroethylene emulsion to obtain an organic-inorganic blend; calendaring and molding the organic-inorganic blend by adopting a calendaring and mixing process to obtain a composite material pre-pressed sheet; and carrying out vacuum hot pressing sintering treatment on the composite material pre-pressed sheet to obtain the microwave composite dielectric substrate. Micro-mesoporous silicon dioxide spheres are formed and form pinning physical interaction with a polytetrafluoroethylene molecular chain, so that the composite material has relatively low dielectric constant, dielectric loss and thermal expansion coefficient.
本发明提出了一种微波复合介质基板及其制备方法，包括：将氨水、去离子水、乙醇以及十六烷基三甲基溴化铵混合均匀，将正硅酸四乙酯加入上述混合溶液中，搅拌反应，反应结束后，经离心、烘干得到固体产物；将上述固体产物经高温煅烧处理，得到微米级的微‑介孔二氧化硅球；将上述微米级的微‑介孔二氧化硅球与聚四氟乙烯乳液混合，得到有机‑无机共混物；将上述有机‑无机共混物采用压延混炼工艺压延成型，得到复合材料预压片；将上述复合材料预压片经真空热压烧结处理，得到微波复合介质基板。通过形成微‑介孔二氧化硅球，与聚四氟乙烯分子链形成“钉扎”物理相互作用，促使复合材料兼具较低的介电常数、介电损耗及热膨胀系数。
Microwave composite dielectric substrate and preparation method thereof
一种微波复合介质基板及其制备方法
2023-12-29
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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