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High-thermal-stability microwave composite dielectric substrate and preparation method thereof
The invention relates to a high-thermal-stability microwave composite dielectric substrate and a preparation method thereof. The composite dielectric substrate includes following raw materials, by mass, 20-70% of an inorganic filling material, 1-10% of glass fibers, 20-80% of a 1,3-butadiene and isoprene polymer system and 0.01-1.5% of a silane coupling agent. The preparation method includes following steps: (1) performing surface modification treatment to the inorganic filling material powder and the glass fiber through the silane coupling agent respectively; (2) fully mixing the treated inorganic filling material powder and glass fiber uniformly; (3) adding the mixture in the step (2) to the 1,3-butadiene and isoprene polymer system solution with addition of an initiator and performing fully stirring and mixing; (4) drying the mixed material solution, and performing extrusion or injection moulding at 50-150 DEG C under 2-20 MPa; (5) combining cut a prepreg with copper foil, and performing hot-press sintering at 80-220 DEG C under 4-20 MPa for 2-4 h to enable the polymer system to be subjected to crosslinking polymerization, thereby moulding the composite dielectric substrate. The composite dielectric substrate is stable in electrical and mechanical performance, is simple in preparation technology and is wide in raw material source.
High-thermal-stability microwave composite dielectric substrate and preparation method thereof
The invention relates to a high-thermal-stability microwave composite dielectric substrate and a preparation method thereof. The composite dielectric substrate includes following raw materials, by mass, 20-70% of an inorganic filling material, 1-10% of glass fibers, 20-80% of a 1,3-butadiene and isoprene polymer system and 0.01-1.5% of a silane coupling agent. The preparation method includes following steps: (1) performing surface modification treatment to the inorganic filling material powder and the glass fiber through the silane coupling agent respectively; (2) fully mixing the treated inorganic filling material powder and glass fiber uniformly; (3) adding the mixture in the step (2) to the 1,3-butadiene and isoprene polymer system solution with addition of an initiator and performing fully stirring and mixing; (4) drying the mixed material solution, and performing extrusion or injection moulding at 50-150 DEG C under 2-20 MPa; (5) combining cut a prepreg with copper foil, and performing hot-press sintering at 80-220 DEG C under 4-20 MPa for 2-4 h to enable the polymer system to be subjected to crosslinking polymerization, thereby moulding the composite dielectric substrate. The composite dielectric substrate is stable in electrical and mechanical performance, is simple in preparation technology and is wide in raw material source.
High-thermal-stability microwave composite dielectric substrate and preparation method thereof
WANG LIJING (author) / ZHANG LIXIN (author) / SONG YONGYAO (author) / PANG ZIBO (author) / XU YONGKUAN (author) / CHENG HONGJUAN (author) / WU CONG (author)
2015-12-09
Patent
Electronic Resource
English
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