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A platform for research: civil engineering, architecture and urbanism
Preparation method of insulating high-thermal-conductivity gasket
The invention discloses a preparation method of an insulating heat-conducting gasket with ultrahigh heat conductivity. The heat-conducting gasket is composed of boron nitride aerogel heat-conducting filler and resin, boron nitride aerogel is prepared by sintering hexagonal boron nitride, boron nitride nanowires and a sintering aid at low pressure and high temperature, and pores of the boron nitride aerogel are filled with the resin. The preparation method comprises the following steps: sintering at low pressure and high temperature to obtain boron nitride aerogel and pressure-induced resin filling, and synchronously realizing construction of a three-dimensional heat-conducting path and filling of ultrahigh-content boron nitride in resin. The heat-conducting gasket obtained by the invention has excellent insulating property and ultrahigh heat conductivity, and can replace most existing insulating heat-conducting gaskets to realize efficient heat management of electronic equipment.
本发明公开了一种超高热导率绝缘导热垫片的制备方法。所述的导热垫片由氮化硼气凝胶导热填料和树脂组成，所述的氮化硼气凝胶由六方氮化硼、氮化硼纳米线和烧结助剂在低压、高温下烧结制成，所述的树脂填充在氮化硼气凝胶孔隙中。所述的制备方法包括：低压高温下烧结得到氮化硼气凝胶与压力诱导树脂填充，同步实现三维导热通路的构建和树脂中超高含量的氮化硼填充。本发明得到的导热垫片在保有优秀的绝缘性能同时，还具有超高的热导率，可以代替大多数现用的绝缘导热垫片，实现电子设备高效热管理。
Preparation method of insulating high-thermal-conductivity gasket
The invention discloses a preparation method of an insulating heat-conducting gasket with ultrahigh heat conductivity. The heat-conducting gasket is composed of boron nitride aerogel heat-conducting filler and resin, boron nitride aerogel is prepared by sintering hexagonal boron nitride, boron nitride nanowires and a sintering aid at low pressure and high temperature, and pores of the boron nitride aerogel are filled with the resin. The preparation method comprises the following steps: sintering at low pressure and high temperature to obtain boron nitride aerogel and pressure-induced resin filling, and synchronously realizing construction of a three-dimensional heat-conducting path and filling of ultrahigh-content boron nitride in resin. The heat-conducting gasket obtained by the invention has excellent insulating property and ultrahigh heat conductivity, and can replace most existing insulating heat-conducting gaskets to realize efficient heat management of electronic equipment.
本发明公开了一种超高热导率绝缘导热垫片的制备方法。所述的导热垫片由氮化硼气凝胶导热填料和树脂组成，所述的氮化硼气凝胶由六方氮化硼、氮化硼纳米线和烧结助剂在低压、高温下烧结制成，所述的树脂填充在氮化硼气凝胶孔隙中。所述的制备方法包括：低压高温下烧结得到氮化硼气凝胶与压力诱导树脂填充，同步实现三维导热通路的构建和树脂中超高含量的氮化硼填充。本发明得到的导热垫片在保有优秀的绝缘性能同时，还具有超高的热导率，可以代替大多数现用的绝缘导热垫片，实现电子设备高效热管理。
Preparation method of insulating high-thermal-conductivity gasket
一种绝缘高导热垫片制备方法
LI MENGXIONG (author) / LI ZHAOLI (author) / PAN LEIMING (author) / LU JIE (author)
2023-12-29
Patent
Electronic Resource
Chinese
IPC:
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
C04B
Kalk
,
LIME
/
C08J
Verarbeitung
,
WORKING-UP
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
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