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Plastic-coated molding method for ceramic rear cover of mobile phone
The invention relates to the technical field of mobile phone rear cover machining, and particularly discloses a mobile phone ceramic rear cover plastic coating forming method which is low in machining cost and stable in ceramic and plastic bonding and comprises the following steps that S1, ceramic raw materials are taken to be sintered, and a ceramic structural part blank is obtained; s2, the ceramic structural part blank is subjected to grinding, fine carving, hot isostatic pressing and heat treatment, and a ceramic wafer is obtained; s3, coating glue on the ceramic wafer to form a glue coating layer, wherein the glue at least comprises polyurethane and isocyanate; and S4, performing injection molding on the surface of the glue coating layer to obtain the rubber-coated ceramic rear cover. According to the method, the ceramic rear cover with the rubber coating layer is obtained through injection molding on the surface of the rubber coating layer, the mode of manual rubber coating and manual ceramic chip and plastic pasting is replaced, the rubber coating efficiency of the ceramic rear cover is improved, and the operation cost is reduced; and the glue is respectively connected with the ceramic chip and the plastic in a chemical bonding manner, so that the stability of connection between the plastic and the ceramic chip is improved, and the service life of the ceramic rear cover of the mobile phone is prolonged.
本发明涉及手机后盖加工技术领域，具体公开了一种加工成本低、陶瓷与塑胶结合稳定的手机陶瓷后盖包塑胶成型方法，该方法包括以下步骤S1、取陶瓷原料进行烧结，得到陶瓷结构件毛坯；S2、对陶瓷结构件毛坯研磨、精雕、热等静压及热处理，得到陶瓷片；S3、在陶瓷片上涂敷胶水以形成涂胶层，胶水至少包含聚氨酯和异氰酸酯；S4、在涂胶层的表面注塑，以获得包胶陶瓷后盖。上述方法通过在涂胶层表面注塑获得具有包胶层的陶瓷后盖，取代人工涂胶和手动粘贴陶瓷片与塑胶方式，提高陶瓷后盖包胶效率，降低了作业成本；胶水分别与陶瓷片和塑胶以化学结合的方式连接在一起，提高了塑胶与陶瓷片连接的稳定性，延长了手机陶瓷后盖的使用寿命。
Plastic-coated molding method for ceramic rear cover of mobile phone
The invention relates to the technical field of mobile phone rear cover machining, and particularly discloses a mobile phone ceramic rear cover plastic coating forming method which is low in machining cost and stable in ceramic and plastic bonding and comprises the following steps that S1, ceramic raw materials are taken to be sintered, and a ceramic structural part blank is obtained; s2, the ceramic structural part blank is subjected to grinding, fine carving, hot isostatic pressing and heat treatment, and a ceramic wafer is obtained; s3, coating glue on the ceramic wafer to form a glue coating layer, wherein the glue at least comprises polyurethane and isocyanate; and S4, performing injection molding on the surface of the glue coating layer to obtain the rubber-coated ceramic rear cover. According to the method, the ceramic rear cover with the rubber coating layer is obtained through injection molding on the surface of the rubber coating layer, the mode of manual rubber coating and manual ceramic chip and plastic pasting is replaced, the rubber coating efficiency of the ceramic rear cover is improved, and the operation cost is reduced; and the glue is respectively connected with the ceramic chip and the plastic in a chemical bonding manner, so that the stability of connection between the plastic and the ceramic chip is improved, and the service life of the ceramic rear cover of the mobile phone is prolonged.
本发明涉及手机后盖加工技术领域，具体公开了一种加工成本低、陶瓷与塑胶结合稳定的手机陶瓷后盖包塑胶成型方法，该方法包括以下步骤S1、取陶瓷原料进行烧结，得到陶瓷结构件毛坯；S2、对陶瓷结构件毛坯研磨、精雕、热等静压及热处理，得到陶瓷片；S3、在陶瓷片上涂敷胶水以形成涂胶层，胶水至少包含聚氨酯和异氰酸酯；S4、在涂胶层的表面注塑，以获得包胶陶瓷后盖。上述方法通过在涂胶层表面注塑获得具有包胶层的陶瓷后盖，取代人工涂胶和手动粘贴陶瓷片与塑胶方式，提高陶瓷后盖包胶效率，降低了作业成本；胶水分别与陶瓷片和塑胶以化学结合的方式连接在一起，提高了塑胶与陶瓷片连接的稳定性，延长了手机陶瓷后盖的使用寿命。
Plastic-coated molding method for ceramic rear cover of mobile phone
一种手机陶瓷后盖包塑胶成型方法
OH JI-SUNG (author) / ZHU CHENHONG (author) / WANG JUN (author) / XIE WANGFU (author) / TIAN TIAN (author)
2024-01-02
Patent
Electronic Resource
Chinese
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