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Ceramic copper-clad substrate and preparation method thereof
The invention discloses a ceramic copper-clad substrate and a preparation method thereof, the ceramic copper-clad substrate comprises a ceramic base layer, a copper metal layer, a reaction layer, a solid solution layer and an intermetallic compound layer, the reaction layer, the solid solution layer and the intermetallic compound layer are located between the ceramic base layer and the copper metal layer, and the reaction layer is adjacent to the ceramic base layer and is formed by reaction of Ti and ceramic; the solid solution layer is formed by solid solution of Sn in Cu; the intermetallic compound layer contains Cu, Ti, and P. According to the invention, the ceramic base layer and the copper metal layer of the ceramic copper-clad substrate have high bonding capability, and the Cu-P-Sn brazing filler metal with low cost is adopted, so that the material cost of the substrate is low.
本发明公开了一种陶瓷覆铜基板及其制备方法，陶瓷覆铜基板包括陶瓷基层和铜金属层，以及位于陶瓷基层和铜金属层之间的反应层、固溶层和金属间化合物层，反应层与陶瓷基层相邻，由Ti与陶瓷反应形成；固溶层由Sn固溶于Cu形成；金属间化合物层含有Cu、Ti和P。根据本发明，陶瓷覆铜基板的陶瓷基层与铜金属层之间具有较高的接合能力，而且由于采用成本较低的Cu‑P‑Sn钎料，使得基板的材料成本较低。
Ceramic copper-clad substrate and preparation method thereof
The invention discloses a ceramic copper-clad substrate and a preparation method thereof, the ceramic copper-clad substrate comprises a ceramic base layer, a copper metal layer, a reaction layer, a solid solution layer and an intermetallic compound layer, the reaction layer, the solid solution layer and the intermetallic compound layer are located between the ceramic base layer and the copper metal layer, and the reaction layer is adjacent to the ceramic base layer and is formed by reaction of Ti and ceramic; the solid solution layer is formed by solid solution of Sn in Cu; the intermetallic compound layer contains Cu, Ti, and P. According to the invention, the ceramic base layer and the copper metal layer of the ceramic copper-clad substrate have high bonding capability, and the Cu-P-Sn brazing filler metal with low cost is adopted, so that the material cost of the substrate is low.
本发明公开了一种陶瓷覆铜基板及其制备方法，陶瓷覆铜基板包括陶瓷基层和铜金属层，以及位于陶瓷基层和铜金属层之间的反应层、固溶层和金属间化合物层，反应层与陶瓷基层相邻，由Ti与陶瓷反应形成；固溶层由Sn固溶于Cu形成；金属间化合物层含有Cu、Ti和P。根据本发明，陶瓷覆铜基板的陶瓷基层与铜金属层之间具有较高的接合能力，而且由于采用成本较低的Cu‑P‑Sn钎料，使得基板的材料成本较低。
Ceramic copper-clad substrate and preparation method thereof
陶瓷覆铜基板及其制备方法
ZHOU WEI (author) / XU QIANG (author) / LIU WEIWEI (author) / WU LEI (author)
2024-01-09
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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