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A platform for research: civil engineering, architecture and urbanism
Preparation method of heating solid wood composite floor and heating solid wood composite floor
The embodiment of the invention provides a preparation method of a heating solid wood composite floor and the heating solid wood composite floor. The preparation method of the heating solid wood composite floor comprises the steps that the front face of the multi-layer board is coated with a hot melt adhesive solution; the heating chip is flatly laid on the surface of the multi-layer board to be subjected to cold pressing pasting; wherein the multilayer board is perforated, so that a conductive electrode of the heating chip is exposed, and the heating chip is connected with a power supply; the surface base material is coated with the hot melt adhesive liquid according to the adhesive applying amount of 20 g/m < 2 > to 100 g/m < 2 >; and the surface base material is pressed on the heating chip. According to the heating solid wood composite floor, the heating chips are electrified to generate heat to achieve the heating effect, and the hot melt adhesive is added in the compounding process, so that the deformation of the surface base material and/or the multilayer board caused by the temperature rise of the heating chips is effectively reduced.
本发明实施例提出一种发热实木复合地板的制备方法及发热实木复合地板。发热实木复合地板的制备方法包括将热熔胶液涂刷到多层板正面；将发热芯片平铺至多层板表面进行冷压贴；其中，将多层板开孔使所述发热芯片的导电极露出以用于所述发热芯片与电源连接；将热熔胶液以20g/m2～100g/m2施胶量涂刷到表面基材上；表面基材压贴在发热芯片上。本发明的发热实木复合地板将所述发热芯片通电后产生热量达到制暖效果，而且在复合过程中加入热熔胶，有效减小发热芯片升温造成表面基材和/或多层板产生的变形。
Preparation method of heating solid wood composite floor and heating solid wood composite floor
The embodiment of the invention provides a preparation method of a heating solid wood composite floor and the heating solid wood composite floor. The preparation method of the heating solid wood composite floor comprises the steps that the front face of the multi-layer board is coated with a hot melt adhesive solution; the heating chip is flatly laid on the surface of the multi-layer board to be subjected to cold pressing pasting; wherein the multilayer board is perforated, so that a conductive electrode of the heating chip is exposed, and the heating chip is connected with a power supply; the surface base material is coated with the hot melt adhesive liquid according to the adhesive applying amount of 20 g/m < 2 > to 100 g/m < 2 >; and the surface base material is pressed on the heating chip. According to the heating solid wood composite floor, the heating chips are electrified to generate heat to achieve the heating effect, and the hot melt adhesive is added in the compounding process, so that the deformation of the surface base material and/or the multilayer board caused by the temperature rise of the heating chips is effectively reduced.
本发明实施例提出一种发热实木复合地板的制备方法及发热实木复合地板。发热实木复合地板的制备方法包括将热熔胶液涂刷到多层板正面；将发热芯片平铺至多层板表面进行冷压贴；其中，将多层板开孔使所述发热芯片的导电极露出以用于所述发热芯片与电源连接；将热熔胶液以20g/m2～100g/m2施胶量涂刷到表面基材上；表面基材压贴在发热芯片上。本发明的发热实木复合地板将所述发热芯片通电后产生热量达到制暖效果，而且在复合过程中加入热熔胶，有效减小发热芯片升温造成表面基材和/或多层板产生的变形。
Preparation method of heating solid wood composite floor and heating solid wood composite floor
发热实木复合地板的制备方法及发热实木复合地板
ZHANG AIBIN (author) / LI YONGWU (author) / YANG MIN (author) / PAN YONGHUA (author)
2024-01-26
Patent
Electronic Resource
Chinese
IPC:
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
B05D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
,
Verfahren zum Aufbringen von Flüssigkeiten oder von anderen fließfähigen Stoffen auf Oberflächen allgemein
/
B27M
Holzbearbeitung, soweit nicht in den Unterklassen B27B-B27L vorgesehen
,
WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B-B27L
/
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
/
F24D
DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS
,
Haus- oder Raumheizungssysteme, z.B. Zentralheizungssysteme
Anti-cracking floor heating solid wood composite floor and production method thereof
| European Patent Office | 2015
| European Patent Office | 2024