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A platform for research: civil engineering, architecture and urbanism
Method for sealing AlN ceramic through glass-ceramic
The invention relates to a method for sealing AlN ceramic, in particular to a method for sealing AlN ceramic through glass-ceramic. The invention aims to solve the technical problems of low room-temperature strength and non-insulation of an AlN ceramic joint connected by metal brazing at present. The glass-ceramic solder provided by the invention is used for sealing the AlN ceramic, the solder is high in adaptability and has no requirement on the surface roughness of a ceramic base material, the AlN ceramic is directly sealed in an Ar gas or N2 gas atmosphere, the glass-ceramic interacts on an AlN interface after being molten, and an element interdiffusion layer is formed at the interface, so that the interface combination is reliable, and the bonding strength is high. A ceramic phase is generated in a welding seam through a devitrification reaction, finally, the welding seam is composed of the ceramic phase and a small amount of residual glass phase, and the maximum room-temperature shear strength of a connector obtained after heat preservation is conducted for 10 minutes at the temperature of 1380 DEG C reaches 57 MPa. The glass-ceramic solder is applied to the AlN ceramic sealing method, and a technology is provided for application of AlN in a semiconductor heat bearing assembly.
一种玻璃‑陶瓷封接AlN陶瓷的方法，涉及一种封接AlN陶瓷的方法。本发明是要解决目前金属钎焊连接AlN陶瓷接头的室温强度低以及不绝缘的技术问题。本发明提供的玻璃‑陶瓷焊料用于AlN陶瓷的封接，该焊料适应性强，对陶瓷母材表面粗糙度无要求，并采用Ar气或N2气气氛下直接封接AlN陶瓷，玻璃‑陶瓷熔化后在AlN界面交互作用，在界面处形成元素互扩散层，使得界面结合可靠，焊缝中通过析晶反应生成陶瓷相，最终焊缝由陶瓷相与少量残余玻璃相构成，在1380℃保温10分钟得到的接头的室温最大抗剪强度达到57MPa。本发明的玻璃‑陶瓷焊料用于AlN陶瓷封接方法，为AlN在半导体承热组件中的应用提供技术。
Method for sealing AlN ceramic through glass-ceramic
The invention relates to a method for sealing AlN ceramic, in particular to a method for sealing AlN ceramic through glass-ceramic. The invention aims to solve the technical problems of low room-temperature strength and non-insulation of an AlN ceramic joint connected by metal brazing at present. The glass-ceramic solder provided by the invention is used for sealing the AlN ceramic, the solder is high in adaptability and has no requirement on the surface roughness of a ceramic base material, the AlN ceramic is directly sealed in an Ar gas or N2 gas atmosphere, the glass-ceramic interacts on an AlN interface after being molten, and an element interdiffusion layer is formed at the interface, so that the interface combination is reliable, and the bonding strength is high. A ceramic phase is generated in a welding seam through a devitrification reaction, finally, the welding seam is composed of the ceramic phase and a small amount of residual glass phase, and the maximum room-temperature shear strength of a connector obtained after heat preservation is conducted for 10 minutes at the temperature of 1380 DEG C reaches 57 MPa. The glass-ceramic solder is applied to the AlN ceramic sealing method, and a technology is provided for application of AlN in a semiconductor heat bearing assembly.
一种玻璃‑陶瓷封接AlN陶瓷的方法，涉及一种封接AlN陶瓷的方法。本发明是要解决目前金属钎焊连接AlN陶瓷接头的室温强度低以及不绝缘的技术问题。本发明提供的玻璃‑陶瓷焊料用于AlN陶瓷的封接，该焊料适应性强，对陶瓷母材表面粗糙度无要求，并采用Ar气或N2气气氛下直接封接AlN陶瓷，玻璃‑陶瓷熔化后在AlN界面交互作用，在界面处形成元素互扩散层，使得界面结合可靠，焊缝中通过析晶反应生成陶瓷相，最终焊缝由陶瓷相与少量残余玻璃相构成，在1380℃保温10分钟得到的接头的室温最大抗剪强度达到57MPa。本发明的玻璃‑陶瓷焊料用于AlN陶瓷封接方法，为AlN在半导体承热组件中的应用提供技术。
Method for sealing AlN ceramic through glass-ceramic
一种玻璃-陶瓷封接AlN陶瓷的方法
HE ZONGJING (author) / SUN LIANGBO (author) / XU HUINING (author) / XING CHAO (author) / TAN YIQIU (author)
2024-01-26
Patent
Electronic Resource
Chinese
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