A platform for research: civil engineering, architecture and urbanism
Thermal insulation wallboard and production method
The thermal insulation wallboard comprises a first pouring structure layer, a thermal insulation structure layer and a second pouring structure layer which are sequentially arranged in a stacked mode, and the first pouring structure layer is formed by pouring ultra-high performance concrete; meanwhile, the first pouring structure layer, the heat preservation structure layer and the second pouring structure layer are connected through the heat preservation connecting pieces, and the structural strength of the heat preservation wallboard is further enhanced; the ultra-high performance concrete has ultra-high compressive strength and strong bending performance, and the first pouring structure layer and the second pouring structure layer can be made to be lighter and thinner, so that the weight of the sandwich heat preservation wallboard is greatly reduced, the size of the heat preservation wallboard can be made to be larger, structural abutted seams are reduced as much as possible, and the heat preservation effect is improved. The waterproof performance of the building is improved; meanwhile, the thickness of the thermal insulation structure layer is increased, so that the thermal insulation performance of the thermal insulation cavity is improved, and the weight of the thermal insulation wallboard is reduced. The invention also provides a production method of the thermal insulation wallboard.
本发明公开一种保温墙板,包括依次层叠设置的第一浇筑结构层、保温结构层以及第二浇筑结构层,第一浇筑结构层由超高性能混凝土浇筑制成;同时利用保温连接件连接第一浇筑结构层、保温结构层以及第二浇筑结构层,进一步增强了保温墙板的结构强度;且超高性能混凝土具有超高的抗压强度和强大的弯折性能,可将第一浇筑结构层和第二浇筑结构层做的更加轻薄,从而大大降低夹心保温墙板的重量,也有利于将保温墙板的尺寸做的更大,以尽可能减少结构上的拼缝,进而提高建筑防水性能;同时也有利于增加保温结构层的厚度,从而提高保温腔体的保温隔热性能,减轻保温墙板的重量。本发明还提供一种上述保温墙板的生产方法。
Thermal insulation wallboard and production method
The thermal insulation wallboard comprises a first pouring structure layer, a thermal insulation structure layer and a second pouring structure layer which are sequentially arranged in a stacked mode, and the first pouring structure layer is formed by pouring ultra-high performance concrete; meanwhile, the first pouring structure layer, the heat preservation structure layer and the second pouring structure layer are connected through the heat preservation connecting pieces, and the structural strength of the heat preservation wallboard is further enhanced; the ultra-high performance concrete has ultra-high compressive strength and strong bending performance, and the first pouring structure layer and the second pouring structure layer can be made to be lighter and thinner, so that the weight of the sandwich heat preservation wallboard is greatly reduced, the size of the heat preservation wallboard can be made to be larger, structural abutted seams are reduced as much as possible, and the heat preservation effect is improved. The waterproof performance of the building is improved; meanwhile, the thickness of the thermal insulation structure layer is increased, so that the thermal insulation performance of the thermal insulation cavity is improved, and the weight of the thermal insulation wallboard is reduced. The invention also provides a production method of the thermal insulation wallboard.
本发明公开一种保温墙板,包括依次层叠设置的第一浇筑结构层、保温结构层以及第二浇筑结构层,第一浇筑结构层由超高性能混凝土浇筑制成;同时利用保温连接件连接第一浇筑结构层、保温结构层以及第二浇筑结构层,进一步增强了保温墙板的结构强度;且超高性能混凝土具有超高的抗压强度和强大的弯折性能,可将第一浇筑结构层和第二浇筑结构层做的更加轻薄,从而大大降低夹心保温墙板的重量,也有利于将保温墙板的尺寸做的更大,以尽可能减少结构上的拼缝,进而提高建筑防水性能;同时也有利于增加保温结构层的厚度,从而提高保温腔体的保温隔热性能,减轻保温墙板的重量。本发明还提供一种上述保温墙板的生产方法。
Thermal insulation wallboard and production method
一种保温墙板及生产方法
2024-02-02
Patent
Electronic Resource
Chinese
IPC:
E04C
STRUCTURAL ELEMENTS
,
Bauelemente
/
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
Thermal insulation wallboard and production method thereof
European Patent Office | 2023
|European Patent Office | 2024
|