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Ultra-thick copper metallized ceramic substrate and preparation method thereof
The invention discloses an ultra-thick copper metallized ceramic substrate and a preparation method thereof, and belongs to the technical field of ceramic bases. The metal copper plate of the ultra-thick copper metallization ceramic substrate covers the outer surface of the ceramic plate. The preparation method of the ultra-thick copper metalized ceramic substrate comprises the following steps: placing a pre-oxidized copper sheet on a ceramic plate, then sintering, and after sintering is completed, cooling to room temperature to obtain the ultra-thick copper metalized ceramic substrate. The manufactured ultra-thick copper metallized ceramic substrate has excellent current bearing capacity, and the manufacturing process is novel and easy and convenient to operate.
本发明公开了一种超厚铜金属化陶瓷基板及制备方法，属于陶瓷基本技术领域。超厚铜金属化陶瓷基板金属铜板覆着在陶瓷板外表面。超厚铜金属化陶瓷基板的制备方法，包括如下步骤：将预氧化后的铜片置于陶瓷板上，然后进行烧结，烧结完成后，冷却至室温，即得超厚铜金属化陶瓷基板。制得的超厚铜金属化陶瓷基板具有优异的电流承载能力，且制作工艺新颖，操作简便。
Ultra-thick copper metallized ceramic substrate and preparation method thereof
The invention discloses an ultra-thick copper metallized ceramic substrate and a preparation method thereof, and belongs to the technical field of ceramic bases. The metal copper plate of the ultra-thick copper metallization ceramic substrate covers the outer surface of the ceramic plate. The preparation method of the ultra-thick copper metalized ceramic substrate comprises the following steps: placing a pre-oxidized copper sheet on a ceramic plate, then sintering, and after sintering is completed, cooling to room temperature to obtain the ultra-thick copper metalized ceramic substrate. The manufactured ultra-thick copper metallized ceramic substrate has excellent current bearing capacity, and the manufacturing process is novel and easy and convenient to operate.
本发明公开了一种超厚铜金属化陶瓷基板及制备方法，属于陶瓷基本技术领域。超厚铜金属化陶瓷基板金属铜板覆着在陶瓷板外表面。超厚铜金属化陶瓷基板的制备方法，包括如下步骤：将预氧化后的铜片置于陶瓷板上，然后进行烧结，烧结完成后，冷却至室温，即得超厚铜金属化陶瓷基板。制得的超厚铜金属化陶瓷基板具有优异的电流承载能力，且制作工艺新颖，操作简便。
Ultra-thick copper metallized ceramic substrate and preparation method thereof
超厚铜金属化陶瓷基板及制备方法
SHI CHUNXI (author) / FENG JIAWEI (author)
2024-03-12
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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