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Thick-film metallized ceramic heat sink for laser and preparation method of thick-film metallized ceramic heat sink
The invention relates to a thick film metallization ceramic heat sink for a laser and a preparation method thereof, the thick film metallization ceramic heat sink comprises a matrix with a rectangular cross section and a metallization material arranged on the surface of the matrix, the metallization material comprises a thick film metallization Au pattern and a thick film metallization PdAg pattern which are respectively printed on two adjacent side surfaces of the matrix, and the thickness of the thick film metallization Au pattern is smaller than that of the thick film metallization PdAg pattern at the pattern connection part. The base body is provided with inclined chamfers, and the inclined chamfers enable the section of the base body to be pentagonal; and a thick film metallization PdAg narrow band is also printed at the joint of the thick film metallization Au pattern and the inclined chamfer and below the thick film metallization Au pattern. According to the invention, the inclined chamfer is arranged on the substrate, so that the PdAg slurry can be stored at the chamfer, the conduction reliability of the thick-film metallization Au pattern and the thick-film metallization PdAg pattern is ensured, and the PdAg narrow band can also avoid the circuit break phenomenon possibly caused by the fact that tin solder is soldered on the gold during welding.
本发明涉及一种激光器用厚膜金属化陶瓷热沉及其制备方法，包括截面呈矩形的基体和设置在所述基体表面的金属化材料，所述金属化材料为分别印刷在基体两个相邻侧面上的厚膜金属化Au图形和厚膜金属化PdAg图形，在图形连接处，设置有倾斜倒角，所述倾斜倒角使所述基体的截面呈五边形；在所述厚膜金属化Au图形和倾斜倒角的连接处，且在所述厚膜金属化Au图形的下方，还印刷有一个厚膜金属化PdAg窄带。本发明通过在基体上设置倾斜倒角，可使得PdAg浆料在倒角处蓄留，保证厚膜金属化Au图形和厚膜金属化PdAg图形的导通可靠性，PdAg窄带还能够避免焊接时锡焊料吃金可能产生的断路现象。
Thick-film metallized ceramic heat sink for laser and preparation method of thick-film metallized ceramic heat sink
The invention relates to a thick film metallization ceramic heat sink for a laser and a preparation method thereof, the thick film metallization ceramic heat sink comprises a matrix with a rectangular cross section and a metallization material arranged on the surface of the matrix, the metallization material comprises a thick film metallization Au pattern and a thick film metallization PdAg pattern which are respectively printed on two adjacent side surfaces of the matrix, and the thickness of the thick film metallization Au pattern is smaller than that of the thick film metallization PdAg pattern at the pattern connection part. The base body is provided with inclined chamfers, and the inclined chamfers enable the section of the base body to be pentagonal; and a thick film metallization PdAg narrow band is also printed at the joint of the thick film metallization Au pattern and the inclined chamfer and below the thick film metallization Au pattern. According to the invention, the inclined chamfer is arranged on the substrate, so that the PdAg slurry can be stored at the chamfer, the conduction reliability of the thick-film metallization Au pattern and the thick-film metallization PdAg pattern is ensured, and the PdAg narrow band can also avoid the circuit break phenomenon possibly caused by the fact that tin solder is soldered on the gold during welding.
本发明涉及一种激光器用厚膜金属化陶瓷热沉及其制备方法，包括截面呈矩形的基体和设置在所述基体表面的金属化材料，所述金属化材料为分别印刷在基体两个相邻侧面上的厚膜金属化Au图形和厚膜金属化PdAg图形，在图形连接处，设置有倾斜倒角，所述倾斜倒角使所述基体的截面呈五边形；在所述厚膜金属化Au图形和倾斜倒角的连接处，且在所述厚膜金属化Au图形的下方，还印刷有一个厚膜金属化PdAg窄带。本发明通过在基体上设置倾斜倒角，可使得PdAg浆料在倒角处蓄留，保证厚膜金属化Au图形和厚膜金属化PdAg图形的导通可靠性，PdAg窄带还能够避免焊接时锡焊料吃金可能产生的断路现象。
Thick-film metallized ceramic heat sink for laser and preparation method of thick-film metallized ceramic heat sink
一种激光器用厚膜金属化陶瓷热沉及其制备方法
LI MANMAN (author) / LI BIN (author) / ZHU SHANWEN (author) / SONG CHEN (author)
2023-07-07
Patent
Electronic Resource
Chinese
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