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A platform for research: civil engineering, architecture and urbanism
Hole wall metallization slurry and preparation method thereof
The invention provides hole wall metallization slurry which comprises tungsten powder, an organic medium, a second solvent and a thixotropic agent, the organic medium comprises a first solvent and a binder, and the invention provides a preparation method of the hole wall metallization slurry. The hole wall metallization slurry provided by the invention is good in printing performance, after printing, the metal slurry on the hole wall is continuous and complete, the film thickness is uniform, the slurry on the hole surface overflows uniformly, the film thickness is less than 10 microns, the overflow is less than 110 microns, the slurry volatilization speed is moderate in the printing process, a screen printing plate is not blocked, batch printing can be realized, the storage stability is good, and the production cost is low. The hole wall metal layer obtained after hole wall metallization is uniform in film thickness and good in continuity, and a good interconnection and conduction effect is achieved.
本发明提供了一种孔壁金属化浆料，包括钨粉、有机介质、第二溶剂和触变剂，所述有机介质包括第一溶剂和粘结剂，并提供了孔壁金属化浆料的制备方法。本发明提供的孔壁金属化浆料印刷性能良好，印刷后，孔壁上金属浆料连续、完整，膜厚均匀、孔表面浆料外溢均匀，膜层厚度＜10um，外溢＜110um，且印刷过程中浆料挥发速度适中，不堵塞网版，可以批量印刷，存放稳定好，孔壁金属化后得到的孔壁金属层膜厚均匀，连续性好，实现良好的互联导通效果。
Hole wall metallization slurry and preparation method thereof
The invention provides hole wall metallization slurry which comprises tungsten powder, an organic medium, a second solvent and a thixotropic agent, the organic medium comprises a first solvent and a binder, and the invention provides a preparation method of the hole wall metallization slurry. The hole wall metallization slurry provided by the invention is good in printing performance, after printing, the metal slurry on the hole wall is continuous and complete, the film thickness is uniform, the slurry on the hole surface overflows uniformly, the film thickness is less than 10 microns, the overflow is less than 110 microns, the slurry volatilization speed is moderate in the printing process, a screen printing plate is not blocked, batch printing can be realized, the storage stability is good, and the production cost is low. The hole wall metal layer obtained after hole wall metallization is uniform in film thickness and good in continuity, and a good interconnection and conduction effect is achieved.
本发明提供了一种孔壁金属化浆料，包括钨粉、有机介质、第二溶剂和触变剂，所述有机介质包括第一溶剂和粘结剂，并提供了孔壁金属化浆料的制备方法。本发明提供的孔壁金属化浆料印刷性能良好，印刷后，孔壁上金属浆料连续、完整，膜厚均匀、孔表面浆料外溢均匀，膜层厚度＜10um，外溢＜110um，且印刷过程中浆料挥发速度适中，不堵塞网版，可以批量印刷，存放稳定好，孔壁金属化后得到的孔壁金属层膜厚均匀，连续性好，实现良好的互联导通效果。
Hole wall metallization slurry and preparation method thereof
一种孔壁金属化浆料及其制备方法
WANG HONG'E (author) / ZHANG LIFANG (author) / ZHAO KUO (author) / PAN YUE (author) / CHEN ZHENG (author)
2024-08-16
Patent
Electronic Resource
Chinese
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