A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Film box door opening device and semiconductor processing equipment
The invention provides a film magazine door opening device and semiconductor processing equipment, in the device, a mounting part is arranged on a first side of an isolation body and is used for opening or sealing a transmission port; a closed cavity is formed in the mounting part, the door opening driving module is arranged in the cavity, and the door opening module is arranged on the side, facing the transmission port, outside the cavity; the connection sealing structure is arranged to penetrate through the mounting part, is connected with the door opening driving module and the door opening module and is used for driving the door opening module to move under the driving of the door opening driving module, and the door opening module is used for taking out the door plate of the film magazine from the initial position through the transmission port in the moving process and carrying the door plate back to the initial position; and the connecting and sealing structure is arranged to seal the through position of the mounting part at least when the door opening module is located at the initial position. According to the scheme, the risk that particles enter the wafer box can be reduced, and the sealing and particle inhibition performance is improved.
本发明提供一种片盒开门装置及半导体加工设备，该装置中，安装部件设置于隔离体的第一侧，用于打开或密封传输口；安装部件中设置有封闭的空腔，开门驱动模块设置于空腔中，开门模块设置于空腔外的朝向传输口的一侧；连接密封结构被设置为贯通安装部件，且分别与开门驱动模块和开门模块连接，用以在开门驱动模块的驱动下带动开门模块移动，开门模块用于在移动过程中自初始位置通过传输口取出片盒的门板，并携带门板返回初始位置；并且，连接密封结构被设置为至少在开门模块位于初始位置时密封安装部件的贯通位置。本方案可以降低颗粒进入片盒的风险，提高密封及颗粒抑制性能。
Film box door opening device and semiconductor processing equipment
The invention provides a film magazine door opening device and semiconductor processing equipment, in the device, a mounting part is arranged on a first side of an isolation body and is used for opening or sealing a transmission port; a closed cavity is formed in the mounting part, the door opening driving module is arranged in the cavity, and the door opening module is arranged on the side, facing the transmission port, outside the cavity; the connection sealing structure is arranged to penetrate through the mounting part, is connected with the door opening driving module and the door opening module and is used for driving the door opening module to move under the driving of the door opening driving module, and the door opening module is used for taking out the door plate of the film magazine from the initial position through the transmission port in the moving process and carrying the door plate back to the initial position; and the connecting and sealing structure is arranged to seal the through position of the mounting part at least when the door opening module is located at the initial position. According to the scheme, the risk that particles enter the wafer box can be reduced, and the sealing and particle inhibition performance is improved.
本发明提供一种片盒开门装置及半导体加工设备，该装置中，安装部件设置于隔离体的第一侧，用于打开或密封传输口；安装部件中设置有封闭的空腔，开门驱动模块设置于空腔中，开门模块设置于空腔外的朝向传输口的一侧；连接密封结构被设置为贯通安装部件，且分别与开门驱动模块和开门模块连接，用以在开门驱动模块的驱动下带动开门模块移动，开门模块用于在移动过程中自初始位置通过传输口取出片盒的门板，并携带门板返回初始位置；并且，连接密封结构被设置为至少在开门模块位于初始位置时密封安装部件的贯通位置。本方案可以降低颗粒进入片盒的风险，提高密封及颗粒抑制性能。
Film box door opening device and semiconductor processing equipment
片盒开门装置及半导体加工设备
HUANG MINTAO (author) / CHANG JIANG (author) / YANG SHUAI (author)
2024-06-14
Patent
Electronic Resource
Chinese
Door opening mechanism of semiconductor process equipment
| European Patent Office | 2023