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Ceramic substrate processing method and ceramic substrate
The ceramic substrate (111) has a ceramic part (112), and the ceramic part (112) contains Al2O3. A method for processing a ceramic substrate (111) is provided with an irradiation step for irradiating a part of the main surface of a ceramic part (112) with laser light (LB). In a method for processing a ceramic substrate (111), a colored portion is formed by an irradiation step.
陶瓷基板(111)具有陶瓷部(112)，陶瓷部(112)含有Al2O3。陶瓷基板(111)的加工方法具备照射工序：对陶瓷部(112)的主表面的一部分照射激光(LB)。陶瓷基板(111)的加工方法中，通过照射工序形成着色部。
Ceramic substrate processing method and ceramic substrate
The ceramic substrate (111) has a ceramic part (112), and the ceramic part (112) contains Al2O3. A method for processing a ceramic substrate (111) is provided with an irradiation step for irradiating a part of the main surface of a ceramic part (112) with laser light (LB). In a method for processing a ceramic substrate (111), a colored portion is formed by an irradiation step.
陶瓷基板(111)具有陶瓷部(112)，陶瓷部(112)含有Al2O3。陶瓷基板(111)的加工方法具备照射工序：对陶瓷部(112)的主表面的一部分照射激光(LB)。陶瓷基板(111)的加工方法中，通过照射工序形成着色部。
Ceramic substrate processing method and ceramic substrate
陶瓷基板的加工方法及陶瓷基板
TAGUSARI MITSURIKI (author)
2024-06-14
Patent
Electronic Resource
Chinese
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