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A platform for research: civil engineering, architecture and urbanism
Resource comprehensive recycling process for wafer cutting, grinding and polishing wastewater in semiconductor manufacturing process
The invention provides a comprehensive recycling process for wafer cutting, grinding and polishing wastewater in a semiconductor manufacturing process, which comprises the following steps of: carrying out solid-liquid separation treatment through a dynamic ceramic membrane filtering system and a clustered filter in sequence under the condition of not adding any chemical reagent; the produced clear liquid is purified by a UF system and/or an RO system after being detected to be qualified so as to realize recycling of semiconductor process wastewater, the invention also provides a preparation method of the ceramic membrane for the process, and the ceramic membrane has hydrophilic property due to titanium oxide, has high bending hardness and high wear resistance coefficient due to zirconium oxide, and can be used for preparing the ceramic membrane for the process. The modified surface coating is pollution-resistant, not easy to block and high in filtering precision. According to the process, solid-liquid separation is directly carried out, the solid phase and the liquid phase are recovered at the same time, the recovered semiconductor fine particles do not contain other impurities and chemical agent residues and are directly subjected to in-situ concentrated air pressure dehydration, drying and bagging in a clustered filter, recycling and transportation are facilitated, the waste water recovery rate is higher than 97%, and the semiconductor fine particle recovery rate is higher than 98%.
本发明提供了半导体制程中晶圆切磨抛废水资源化综合回收利用工艺，在不添加任何化学试剂的条件下，依次经动态陶瓷膜过滤系统和集束式过滤器进行固液分离处理，产生的清液经检测合格后经UF系统和/或RO系统纯化实现半导体制程废水回收利用，同时提供了一种用于该工艺的陶瓷膜的制备方法，由于该陶瓷膜因含有氧化钛而具有亲水属性，因含有氧化锆而具有高弯折硬度，耐磨系数高，表面涂层改性耐污染、不易堵塞，过滤精度高。该工艺直接进行固液分离，同时回收固液两相，回收的半导体微细颗粒，不含其他杂质和化学药剂残留物，直接在集束式过滤器内原位集中气压脱水干化装袋，利于回收利用并方便运送，废水回收率高于97%，半导体微细颗粒回收率高于98%。
Resource comprehensive recycling process for wafer cutting, grinding and polishing wastewater in semiconductor manufacturing process
The invention provides a comprehensive recycling process for wafer cutting, grinding and polishing wastewater in a semiconductor manufacturing process, which comprises the following steps of: carrying out solid-liquid separation treatment through a dynamic ceramic membrane filtering system and a clustered filter in sequence under the condition of not adding any chemical reagent; the produced clear liquid is purified by a UF system and/or an RO system after being detected to be qualified so as to realize recycling of semiconductor process wastewater, the invention also provides a preparation method of the ceramic membrane for the process, and the ceramic membrane has hydrophilic property due to titanium oxide, has high bending hardness and high wear resistance coefficient due to zirconium oxide, and can be used for preparing the ceramic membrane for the process. The modified surface coating is pollution-resistant, not easy to block and high in filtering precision. According to the process, solid-liquid separation is directly carried out, the solid phase and the liquid phase are recovered at the same time, the recovered semiconductor fine particles do not contain other impurities and chemical agent residues and are directly subjected to in-situ concentrated air pressure dehydration, drying and bagging in a clustered filter, recycling and transportation are facilitated, the waste water recovery rate is higher than 97%, and the semiconductor fine particle recovery rate is higher than 98%.
本发明提供了半导体制程中晶圆切磨抛废水资源化综合回收利用工艺，在不添加任何化学试剂的条件下，依次经动态陶瓷膜过滤系统和集束式过滤器进行固液分离处理，产生的清液经检测合格后经UF系统和/或RO系统纯化实现半导体制程废水回收利用，同时提供了一种用于该工艺的陶瓷膜的制备方法，由于该陶瓷膜因含有氧化钛而具有亲水属性，因含有氧化锆而具有高弯折硬度，耐磨系数高，表面涂层改性耐污染、不易堵塞，过滤精度高。该工艺直接进行固液分离，同时回收固液两相，回收的半导体微细颗粒，不含其他杂质和化学药剂残留物，直接在集束式过滤器内原位集中气压脱水干化装袋，利于回收利用并方便运送，废水回收率高于97%，半导体微细颗粒回收率高于98%。
Resource comprehensive recycling process for wafer cutting, grinding and polishing wastewater in semiconductor manufacturing process
半导体制程中晶圆切磨抛废水资源化综合回收利用工艺
ZHU CHANGLI (author) / HE XIANGYANG (author) / JIANG JING (author) / FU TONGYUAN (author) / ZHANG LIYONG (author) / LIU HONGXIA (author)
2024-06-28
Patent
Electronic Resource
Chinese
Experimental Study on Ultrasonic Grinding and Polishing for Large-Scale Silicon Wafer
| British Library Online Contents | 2006