A platform for research: civil engineering, architecture and urbanism
Experimental Study on Ultrasonic Grinding and Polishing for Large-Scale Silicon Wafer
Experimental Study on Ultrasonic Grinding and Polishing for Large-Scale Silicon Wafer
Experimental Study on Ultrasonic Grinding and Polishing for Large-Scale Silicon Wafer
Wang, M. D. (author) / Zuo, D. W. (author) / Wang, M. (author) / Rui, Y. N. (author) / Yuan, Z. / Xu, X. / Zuo, D. / Yuan, J. / Yao, Y.
2006-01-01
4 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Experimental Investigations of Silicon Wafer Grinding
British Library Online Contents | 2007
|Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer
British Library Online Contents | 2004
|Numerical-experimental study on polishing of silicon wafer using magnetic abrasive finishing process
British Library Online Contents | 2019
|Ultra Precision Grinding of Wafer Scale
British Library Online Contents | 2012
|The Experimental Study on Lapping and Polishing of Metal Micro-Coil Based on Silicon Wafer
British Library Online Contents | 2006
|