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Floor heating module insulation board and processing technology thereof
The invention relates to the technical field of floor heating, and provides a floor heating module insulation board and a processing technology thereof.The floor heating module insulation board comprises a board body, the board body is provided with a pouring opening, supporting legs are located in the pouring opening, an annular cavity is formed between the supporting legs and the inner wall of the pouring opening, the supporting legs are arranged in a lifting and sliding mode relative to the board body, and the upper ends of the supporting legs are provided with clamping parts, and the lower ends of the supporting legs are provided with guiding parts; and when the lower ends of the supporting legs are lower than the lower ends of the pouring openings, a pouring area is formed between the plate body and the ground, and the pouring area communicates with the annular cavity. By means of the technical scheme, the problem that in the prior art, when the modules are directly laid on an unsmooth cement base layer, tiny fluctuation of the ground may cause dislocation between the floor heating modules, and consequently local hollowing of the bottom is caused is solved.
本发明涉及地暖技术领域,提出了一种地暖模块保温板及其加工工艺,包括板体,板体具有浇筑口,支腿位于浇筑口内,与浇筑口的内壁之间形成环形腔,支腿相对于板体升降滑动设置,支腿上端具有卡部,下端具有导向部,卡部位于浇筑口内,支脚升降滑动设置在导向部内,支脚下端低于浇筑口的下端时,板体与地面之间形成浇筑区域,浇筑区域与环形腔连通。通过上述技术方案,解决了现有技术中在不够平整的水泥基层上直接铺设这些模块时,地面的微小起伏可能导致地暖模块之间的错位,从而引起底部局部空鼓的问题。
Floor heating module insulation board and processing technology thereof
The invention relates to the technical field of floor heating, and provides a floor heating module insulation board and a processing technology thereof.The floor heating module insulation board comprises a board body, the board body is provided with a pouring opening, supporting legs are located in the pouring opening, an annular cavity is formed between the supporting legs and the inner wall of the pouring opening, the supporting legs are arranged in a lifting and sliding mode relative to the board body, and the upper ends of the supporting legs are provided with clamping parts, and the lower ends of the supporting legs are provided with guiding parts; and when the lower ends of the supporting legs are lower than the lower ends of the pouring openings, a pouring area is formed between the plate body and the ground, and the pouring area communicates with the annular cavity. By means of the technical scheme, the problem that in the prior art, when the modules are directly laid on an unsmooth cement base layer, tiny fluctuation of the ground may cause dislocation between the floor heating modules, and consequently local hollowing of the bottom is caused is solved.
本发明涉及地暖技术领域,提出了一种地暖模块保温板及其加工工艺,包括板体,板体具有浇筑口,支腿位于浇筑口内,与浇筑口的内壁之间形成环形腔,支腿相对于板体升降滑动设置,支腿上端具有卡部,下端具有导向部,卡部位于浇筑口内,支脚升降滑动设置在导向部内,支脚下端低于浇筑口的下端时,板体与地面之间形成浇筑区域,浇筑区域与环形腔连通。通过上述技术方案,解决了现有技术中在不够平整的水泥基层上直接铺设这些模块时,地面的微小起伏可能导致地暖模块之间的错位,从而引起底部局部空鼓的问题。
Floor heating module insulation board and processing technology thereof
一种地暖模块保温板及其加工工艺
LIU LIJUN (author) / ZOU JIANAN (author)
2024-07-05
Patent
Electronic Resource
Chinese
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
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