A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Preparation method of ceramic shell and ceramic shell
The invention provides a preparation method of a ceramic shell and the ceramic shell, and belongs to the technical field of ceramic packaging, and the method provided by the invention comprises the following steps: manufacturing a ceramic solder mask layer through tape casting, and manufacturing an isolation window on the ceramic solder mask layer according to a preset bonding pad pattern position; a ceramic solder mask layer and the ceramic chip lamination are laminated to form a ceramic shell; or, a ceramic solder mask pattern is printed on a ceramic chip needing solder mask manufacturing through silk-screen printing to form an isolation window, and then the ceramic chip is laminated to form a ceramic shell; manufacturing a ball mounting bonding pad in the isolation window, and enabling the ball mounting bonding pad not to protrude out of the surface of the ceramic solder mask layer; and reballing on the bonding pad in the isolation window, and enabling the reballing part to sink into the isolation window. According to the ceramic shell provided by the invention, the ceramic solder mask layer is additionally arranged, so that the flowing and scattering of solder/solder paste can be effectively limited, and the assembly interconnection reliability is improved; the assembly safety distance can be greatly reduced, and high-density integration is achieved.
本发明提供了一种陶瓷外壳的制备方法及陶瓷外壳，属于陶瓷封装技术领域，本发明提供的方法包括流延制作陶瓷阻焊层，并在陶瓷阻焊层上按照预设焊盘图形位置制作隔离窗口；将陶瓷阻焊层与所述陶瓷片叠片层压形成陶瓷外壳；或者，在需要制作阻焊的陶瓷片上采用丝网印刷印制陶瓷阻焊图形形成隔离窗口，然后叠片层压形成陶瓷外壳；在隔离窗口内制作植球焊盘，并使植球焊盘不凸出于陶瓷阻焊层的表面；在隔离窗口内的焊盘上植球，并使植球部分沉于隔离窗口内。本发明提供的陶瓷外壳，通过增加陶瓷阻焊层，可有效限制焊料/焊膏的流散，提高装配互连可靠性；可大幅减小装配安全间距，实现高密度集成。
Preparation method of ceramic shell and ceramic shell
The invention provides a preparation method of a ceramic shell and the ceramic shell, and belongs to the technical field of ceramic packaging, and the method provided by the invention comprises the following steps: manufacturing a ceramic solder mask layer through tape casting, and manufacturing an isolation window on the ceramic solder mask layer according to a preset bonding pad pattern position; a ceramic solder mask layer and the ceramic chip lamination are laminated to form a ceramic shell; or, a ceramic solder mask pattern is printed on a ceramic chip needing solder mask manufacturing through silk-screen printing to form an isolation window, and then the ceramic chip is laminated to form a ceramic shell; manufacturing a ball mounting bonding pad in the isolation window, and enabling the ball mounting bonding pad not to protrude out of the surface of the ceramic solder mask layer; and reballing on the bonding pad in the isolation window, and enabling the reballing part to sink into the isolation window. According to the ceramic shell provided by the invention, the ceramic solder mask layer is additionally arranged, so that the flowing and scattering of solder/solder paste can be effectively limited, and the assembly interconnection reliability is improved; the assembly safety distance can be greatly reduced, and high-density integration is achieved.
本发明提供了一种陶瓷外壳的制备方法及陶瓷外壳，属于陶瓷封装技术领域，本发明提供的方法包括流延制作陶瓷阻焊层，并在陶瓷阻焊层上按照预设焊盘图形位置制作隔离窗口；将陶瓷阻焊层与所述陶瓷片叠片层压形成陶瓷外壳；或者，在需要制作阻焊的陶瓷片上采用丝网印刷印制陶瓷阻焊图形形成隔离窗口，然后叠片层压形成陶瓷外壳；在隔离窗口内制作植球焊盘，并使植球焊盘不凸出于陶瓷阻焊层的表面；在隔离窗口内的焊盘上植球，并使植球部分沉于隔离窗口内。本发明提供的陶瓷外壳，通过增加陶瓷阻焊层，可有效限制焊料/焊膏的流散，提高装配互连可靠性；可大幅减小装配安全间距，实现高密度集成。
Preparation method of ceramic shell and ceramic shell
陶瓷外壳的制备方法及陶瓷外壳
GUO ZHIWEI (author) / DUAN QIANG (author) / YANG ZHENTAO (author) / LI HANGZHOU (author) / LIU BINGQIAN (author)
2024-07-12
Patent
Electronic Resource
Chinese
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