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A platform for research: civil engineering, architecture and urbanism
Carrier substrate for electrical component and method for producing such carrier substrate
The invention relates to a carrier substrate (1) for an electrical component (4), comprising:-a heat sink (20), and-a ceramic element (71), the ceramic element (71) being at least partially bonded to the heat sink (20), a bonding layer without solder material being formed in the produced carrier substrate (1) between the heat sink (20) and the ceramic element (71), and wherein the adhesion promoter layer of the bonding layer has a surface resistance greater than 5 Ohm/sq, preferably greater than 10 Ohm/sq and particularly preferably greater than 20 Ohm/sq.
用于电器件(4)的载体衬底(1)，包括：‑冷却体(20)，和‑陶瓷元件(71)，其中所述陶瓷元件(71)至少部段地接合到所述冷却体(20)上，其中在制成的载体衬底(1)中在所述冷却体(20)与所述陶瓷元件(71)之间构成有无焊接材料的键合层，并且其中所述键合层的增附剂层具有大于5Ohm/sq、优选地大于10Ohm/sq和特别优选地大于20Ohm/sq的表面电阻。
Carrier substrate for electrical component and method for producing such carrier substrate
The invention relates to a carrier substrate (1) for an electrical component (4), comprising:-a heat sink (20), and-a ceramic element (71), the ceramic element (71) being at least partially bonded to the heat sink (20), a bonding layer without solder material being formed in the produced carrier substrate (1) between the heat sink (20) and the ceramic element (71), and wherein the adhesion promoter layer of the bonding layer has a surface resistance greater than 5 Ohm/sq, preferably greater than 10 Ohm/sq and particularly preferably greater than 20 Ohm/sq.
用于电器件(4)的载体衬底(1)，包括：‑冷却体(20)，和‑陶瓷元件(71)，其中所述陶瓷元件(71)至少部段地接合到所述冷却体(20)上，其中在制成的载体衬底(1)中在所述冷却体(20)与所述陶瓷元件(71)之间构成有无焊接材料的键合层，并且其中所述键合层的增附剂层具有大于5Ohm/sq、优选地大于10Ohm/sq和特别优选地大于20Ohm/sq的表面电阻。
Carrier substrate for electrical component and method for producing such carrier substrate
用于电器件的载体衬底和用于制造这种载体衬底的方法
GIL VITALIJ (author) / WIESEND JOHANNES (author) / WEIGEL FABIAN (author)
2024-07-23
Patent
Electronic Resource
Chinese
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