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A platform for research: civil engineering, architecture and urbanism
ESC electrostatic chuck manufacturing process and ESC electrostatic chuck
The invention provides an ESC electrostatic chuck manufacturing process which comprises the following steps: S1, material mixing; s2, casting is carried out; s3, tungsten paste electrode printing; s4, glue discharging; s5, sintering molding; s6, assembling is conducted; s7, detecting; and S8, preparation is completed. A TI titanium metal material is doped in the sintering seed in the step S5, and the doping amount is 6-15% (weight ratio); the doping amount of the doped Y2O3 is 4-5% (weight ratio); the electrostatic chuck surface prepared by the method can replace the original conventional (alumina ceramic, resin or polyimide) electrostatic chuck surface, and has the characteristics that the thermal conductivity can reach 170W/M.K, the leakage current is low, the adsorption effect is good, and the like.
本发明提供一种ESC静电卡盘制造工艺，包括以下步骤，S1：混料；S2：流延；S3：钨浆电极印刷；S4：排胶；S5：烧结成型；S6：装配；S7：检测；S8：制备完成；在所述步骤S5烧结过种中参杂TI钛金属材料，参杂量为6‑15％(重量比)；参杂Y2O3的参杂量为4‑5％(重量比)；将替代原有的常规(氧化铝陶瓷、树脂或聚酰亚胺)静电卡盘表面，导热率可达170W/M·K,低漏电流，吸附效果好等特点。
ESC electrostatic chuck manufacturing process and ESC electrostatic chuck
The invention provides an ESC electrostatic chuck manufacturing process which comprises the following steps: S1, material mixing; s2, casting is carried out; s3, tungsten paste electrode printing; s4, glue discharging; s5, sintering molding; s6, assembling is conducted; s7, detecting; and S8, preparation is completed. A TI titanium metal material is doped in the sintering seed in the step S5, and the doping amount is 6-15% (weight ratio); the doping amount of the doped Y2O3 is 4-5% (weight ratio); the electrostatic chuck surface prepared by the method can replace the original conventional (alumina ceramic, resin or polyimide) electrostatic chuck surface, and has the characteristics that the thermal conductivity can reach 170W/M.K, the leakage current is low, the adsorption effect is good, and the like.
本发明提供一种ESC静电卡盘制造工艺，包括以下步骤，S1：混料；S2：流延；S3：钨浆电极印刷；S4：排胶；S5：烧结成型；S6：装配；S7：检测；S8：制备完成；在所述步骤S5烧结过种中参杂TI钛金属材料，参杂量为6‑15％(重量比)；参杂Y2O3的参杂量为4‑5％(重量比)；将替代原有的常规(氧化铝陶瓷、树脂或聚酰亚胺)静电卡盘表面，导热率可达170W/M·K,低漏电流，吸附效果好等特点。
ESC electrostatic chuck manufacturing process and ESC electrostatic chuck
一种ESC静电卡盘制造工艺及ESC静电卡盘
LIU GUOJIA (author)
2024-10-11
Patent
Electronic Resource
Chinese
| European Patent Office | 2024
| European Patent Office | 2024
| European Patent Office | 2023
| European Patent Office | 2023
| European Patent Office | 2023