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Method for improving interfacial adhesiveness of aggregate and asphalt based on ECIP technology
The invention belongs to the technical field of building materials, and particularly discloses a method for improving the interfacial adhesiveness of aggregate and asphalt based on an ECIP technology, and the method comprises the following steps: preparing an EICP treating fluid: mixing a urease solution and a cementing fluid to obtain the EICP treating fluid; the urease solution is composed of urease and skim milk powder, and the cementing fluid is composed of urea and calcium acetate; carrying out soaking or spraying treatment on the aggregate by adopting an EICP (Ethylene-Inductively Coupled Plasma) treatment solution to obtain modified aggregate; and mixing the modified aggregate with hot asphalt, so that the surface of the modified aggregate is completely coated with the asphalt. The aggregate is treated through an EICP technology, and calcium carbonate precipitates are induced to be generated on the surface of the aggregate. When the asphalt wraps the aggregate, the calcium carbonate precipitate on the surface of the aggregate increases the roughness of the surface, and the aggregate has a calcareous characteristic, so that the adhesiveness of the aggregate and the asphalt is enhanced. In addition, according to the acid-base property of the aggregate, the treatment mode of the EICP treatment liquid is regulated and controlled, so that the adhesiveness of the aggregate and asphalt is remarkably improved while the treatment time is shortened.
本发明属于建筑材料技术领域,具体公开了一种基于ECIP技术提高集料与沥青界面黏附性的方法,包括配制EICP处理液:将脲酶溶液和胶结液混合得到EICP处理液;脲酶溶液由脲酶和脱脂奶粉组成,胶结液由尿素和乙酸钙组成;采用EICP处理液对集料进行浸泡或喷洒处理,得到改性集料;将改性集料与热沥青混合,使改性集料表面完全包裹沥青。本发明通过EICP技术处理集料,诱导集料表面生成碳酸钙沉淀。当沥青包裹集料时,集料表面的碳酸钙沉淀增加了表面的粗糙度,且具有钙质特性,从而增强了集料与沥青的黏附性。本发明还根据集料酸碱性,对EICP处理液的处理方式进行调控,从而在缩短处理时间的同时,显著提高集料与沥青的黏附性。
Method for improving interfacial adhesiveness of aggregate and asphalt based on ECIP technology
The invention belongs to the technical field of building materials, and particularly discloses a method for improving the interfacial adhesiveness of aggregate and asphalt based on an ECIP technology, and the method comprises the following steps: preparing an EICP treating fluid: mixing a urease solution and a cementing fluid to obtain the EICP treating fluid; the urease solution is composed of urease and skim milk powder, and the cementing fluid is composed of urea and calcium acetate; carrying out soaking or spraying treatment on the aggregate by adopting an EICP (Ethylene-Inductively Coupled Plasma) treatment solution to obtain modified aggregate; and mixing the modified aggregate with hot asphalt, so that the surface of the modified aggregate is completely coated with the asphalt. The aggregate is treated through an EICP technology, and calcium carbonate precipitates are induced to be generated on the surface of the aggregate. When the asphalt wraps the aggregate, the calcium carbonate precipitate on the surface of the aggregate increases the roughness of the surface, and the aggregate has a calcareous characteristic, so that the adhesiveness of the aggregate and the asphalt is enhanced. In addition, according to the acid-base property of the aggregate, the treatment mode of the EICP treatment liquid is regulated and controlled, so that the adhesiveness of the aggregate and asphalt is remarkably improved while the treatment time is shortened.
本发明属于建筑材料技术领域,具体公开了一种基于ECIP技术提高集料与沥青界面黏附性的方法,包括配制EICP处理液:将脲酶溶液和胶结液混合得到EICP处理液;脲酶溶液由脲酶和脱脂奶粉组成,胶结液由尿素和乙酸钙组成;采用EICP处理液对集料进行浸泡或喷洒处理,得到改性集料;将改性集料与热沥青混合,使改性集料表面完全包裹沥青。本发明通过EICP技术处理集料,诱导集料表面生成碳酸钙沉淀。当沥青包裹集料时,集料表面的碳酸钙沉淀增加了表面的粗糙度,且具有钙质特性,从而增强了集料与沥青的黏附性。本发明还根据集料酸碱性,对EICP处理液的处理方式进行调控,从而在缩短处理时间的同时,显著提高集料与沥青的黏附性。
Method for improving interfacial adhesiveness of aggregate and asphalt based on ECIP technology
一种基于ECIP技术提高集料与沥青界面黏附性的方法
XI LEI (author) / LIAO YUNCHAO (author) / MA QIANG (author) / XIAO HENGLIN (author) / ZHENG LIFEI (author) / LIN WEIQING (author) / LI WENTAO (author) / ZHANG DERUN (author)
2024-10-15
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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