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Method and device for recycling waste ITO (indium tin oxide) target through combined crushing
The invention discloses a method for recycling waste ITO (Indium Tin Oxide) targets by jointly crushing, which comprises the following steps of: carrying out surface ultrasonic cleaning on the waste ITO targets left by sputtering, and carrying out nanocrystallization treatment on the cleaned waste ITO targets: 1, crushing the blocky waste ITO targets into millimeter-scale small particles by using a jaw crusher; 2, further crushing the small-particle waste ITO target into submicron particles by using an ultramicro jet mill; and 3, mixing the micron-sized powder with a certain mass of water and a dispersing agent by using a sand mill to obtain slurry with the solid content of 50-75%, and further refining the slurry into nano-sized particles. Step 3, mixing the dried powder of the slurry obtained in the step 3 with water, a dispersing agent and a binding agent in a set proportion to obtain ITO slurry with the solid content larger than 80%, conducting pressure grouting to obtain an ITO biscuit, and conducting drying treatment, degreasing and sintering treatment to obtain the ITO sputtering target with the average grain size being 2-10 micrometers, the relative density larger than 99.5% and the resistivity smaller than 0.15 m omega.cm.
本发明公开了一种联合破碎ITO废靶回收利用的方法，包括以下步骤：将溅射剩余的ITO废靶进行表面超声清洗，将清洗干净后的废ITO靶材进行纳米化处理，第一步：用鄂式破碎机将块状的ITO废靶粉碎成毫米级小颗粒；第二步:用超微气流磨将小颗粒的ITO废靶进一步粉碎成亚微米级颗粒；第三步：用砂磨机将微米级粉末与一定质量的水，分散剂，混合为固含量为50‑75％的浆料后进一步细化成纳米级颗粒。将第三步后的浆料经过烘干的粉末与设定比例的水，分散剂，粘结剂混合，得到固含量大于80％的ITO浆料，经过压力注浆得到ITO素坯，在经过干燥处理、脱脂和烧结处理得到平均晶粒尺寸为2‑10μm，相对密度大于99.5％，电阻率小于0.15mΩ·cm的ITO溅射靶材。
Method and device for recycling waste ITO (indium tin oxide) target through combined crushing
The invention discloses a method for recycling waste ITO (Indium Tin Oxide) targets by jointly crushing, which comprises the following steps of: carrying out surface ultrasonic cleaning on the waste ITO targets left by sputtering, and carrying out nanocrystallization treatment on the cleaned waste ITO targets: 1, crushing the blocky waste ITO targets into millimeter-scale small particles by using a jaw crusher; 2, further crushing the small-particle waste ITO target into submicron particles by using an ultramicro jet mill; and 3, mixing the micron-sized powder with a certain mass of water and a dispersing agent by using a sand mill to obtain slurry with the solid content of 50-75%, and further refining the slurry into nano-sized particles. Step 3, mixing the dried powder of the slurry obtained in the step 3 with water, a dispersing agent and a binding agent in a set proportion to obtain ITO slurry with the solid content larger than 80%, conducting pressure grouting to obtain an ITO biscuit, and conducting drying treatment, degreasing and sintering treatment to obtain the ITO sputtering target with the average grain size being 2-10 micrometers, the relative density larger than 99.5% and the resistivity smaller than 0.15 m omega.cm.
本发明公开了一种联合破碎ITO废靶回收利用的方法，包括以下步骤：将溅射剩余的ITO废靶进行表面超声清洗，将清洗干净后的废ITO靶材进行纳米化处理，第一步：用鄂式破碎机将块状的ITO废靶粉碎成毫米级小颗粒；第二步:用超微气流磨将小颗粒的ITO废靶进一步粉碎成亚微米级颗粒；第三步：用砂磨机将微米级粉末与一定质量的水，分散剂，混合为固含量为50‑75％的浆料后进一步细化成纳米级颗粒。将第三步后的浆料经过烘干的粉末与设定比例的水，分散剂，粘结剂混合，得到固含量大于80％的ITO浆料，经过压力注浆得到ITO素坯，在经过干燥处理、脱脂和烧结处理得到平均晶粒尺寸为2‑10μm，相对密度大于99.5％，电阻率小于0.15mΩ·cm的ITO溅射靶材。
Method and device for recycling waste ITO (indium tin oxide) target through combined crushing
一种联合破碎ITO废靶回收利用的方法及装置
LIU YANG (author) / SUN BENSHUANG (author) / ZHANG HUIYU (author) / LIU MIAO (author) / WANG ZHIJUN (author)
2024-10-25
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
/
B01F
MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING
,
Mischen, z.B. Lösen, Emulgieren, Dispergieren
/
B02C
CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL
,
Brechen, Pulverisieren oder Zerkleinern allgemein
/
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
C23C
Beschichten metallischer Werkstoffe
,
COATING METALLIC MATERIAL
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